Room or ambient temperature curing systems offer easy processing and high reliability. These one and two component systems are used in bonding, sealing, coating and potting/encapsulation applications.
Reaction Curing Compounds
Many two component epoxy systems will polymerize at ambient temperatures when the epoxy resin reacts with a hardener. After curing is initiated an exothermic reaction occurs. Set up times range from 4-8 minutes at ambient temperatures to 24 to 48 hours. Their rate of cure will depend on bond line thickness, humidity, temperature and the types of substrates they are joining.
- Two component epoxies
Addition Cured Systems
Room temperature vulcanizing (RTV) silicones cure at room temperature when the base component is mixed with a catalyst. Addition cured system do not require exposure to air for cross-linking. No by-products are released during cure. They can cure in closed environments. These systems feature outstanding flexibility combined with high temperature resistance.
- Two component silicones
Water Evaporation Curing
One part, no mix water based adhesive systems feature convenient cure schedules and simple dispensing. These ecologically safe, non-toxic, non-flammable formulations bond well to many substrates. Products offer good setting characteristics, spread smoothly and are odorless. These cost effective compounds can be diluted with water and can cure more rapidly upon exposure to heat.
- Latex systems
- Silicate based systems
Moisture Curing Adhesive Systems
Master Bond ready-to-use one component moisture curing adhesives feature easy application. They reduce manufacturing costs, bond well to many similar/dissimilar substrates and are serviceable over a wide temperature range. These compounds alleviate pot life concerns and eliminate waste. They provide consistent, reliable performance and are employed in the assembly of many industrial products.
- One part silicones
Most Popular Room Temperature Curing Adhesives, Sealants, Coatings, Potting and Encapsulation Compounds
Moderate viscosity room temperature curing epoxy adhesive, sealant, coating, encapsulant. Convenient one to one mix ratio, weight or volume. Mix ratio can be altered to give a more rigid or flexible cure. High strength system. Withstands exposure to many chemicals. Reliable electrical insulator. Serviceable from -60°F to +250°F.
UV curable system with superior resistance to chemicals, particularly solvents. High bond strength. Excellent light transmission properties. Electrical insulator. Low shrinkage upon cure. Exceptionally fast curing. Serviceable from -60°F to 250°F.
Two part silicone paste for bonding and sealing applications. Outstanding flexibility. Low exotherm and long pot life system. Self priming feature. Contains no solvents or diluents. Superior electrical insulation properties. Can cure in wide sections vertically and horizontally. Serviceable from -65°F to +400°F
Non-drip epoxy paste passes NASA low outgassing requirements. Can be applied without sagginf on vertical surfaces. Gap filling. Dimensionally stable. Cures at ambient temperatures. Long term durability. Serviceable from -60°F to 250°F.
Flexible epoxy adhesive has rapid set up time and cure speed. High peel strength and elongation. Withstands mechanical shock and vibration. Resists thermal cycling. Superb electrical insulation properties. Service operating temperature range from -100°F to +250°F.
Excellent adhesion to metals and engineering plastics such as polycarbonates, acrylics. Flexible. Low to moderate viscosity bonding, potting, sealing, encapsulation compound. High shear/peel strength. Resists mechanical shocks and vibration. Moderately low exotherm during cure. Serviceable from -80°F to +250°F.
Environmentally safe, water soluble, one part system. Thermal stability up to +1,500°F. Outstanding strength, dimensional stability and electrical insulation properties. Completely odorless, non-toxic and non-flammable. Cures obtained at moderately elevated temperatures.
Higher viscosity (2,200-2,400 cps) and a slightly longer open time than low viscosity counterparts. High strength, rapid curing ethyl cyanoacrylate system. No heating or mixing needed. Good resistance to cleaning agents. Serviceable from -60°F to +250°F.
High viscosity epoxy adhesive offers excellent thermal stability. Serviceable from -60°F to +450-500°F. Durable. High strength bonds are maintained even after long-term exposures to elevated temperatures. Outstanding resistance to chemical exposure.