Master Bond’s unique glob top compounds are ideal for the encapsulation of semiconductor chips and wire bonds mostly in chip on board (COB) applications. These formulations offer protection against moisture, chemicals and contaminants. Additionally, they minimize the thermal mismatch between chips and substrates. They also provide mechanical support and electrically insulative properties.
Types of Glob Top Coatings
- One component epoxies
- Two component epoxies
- UV curing systems
Benefits of Master Bond Glob Top Coatings
- Low stress
- Low outgassing
- Low shrinkage
- Easy application
- High purity
- Fast cure speeds
- Special flow properties
Master Bond’s Most Popular Glob Top Formulations
One part, UV curable epoxy with ultra fast curing. Good physical properties and chemical resistance. Used for glob top applications. Thixotropic paste viscosity. Excellent toughness. Withstands thermal cycling. Shore D hardness 65. Serviceable from -80°F to +250°F.
Superior one part glob top. Outstanding dimensional stability and temperature resistance. Fast cures at 125-150°C. Ideal flow for glob topping. Serviceable from -100°F to +400°F. Excellent electrical insulation properties. Low shrinkage. Resists thermal cycling.
Two part, room temperature curing epoxy with easy handling and very good physical strength properties. Non-drip paste. For bonding, sealing, coating. One to one mix ratio. Chemically resistant. Gap filling. Variable mix ratio allows adjusting hardness of cure. Low shrinkage. Service temperature range from -60°F to 250°F.
High viscosity paste. Does not drip on vertical surfaces. Fast "5 minute" curing, two component epoxy adhesive. High bond strength. Serviceable from -100°F to +250°F. Superior durability. One to one mix ratio weight or volume. Excellent dielectric properties.
One part epoxy for bonding, sealing, and dam-and-fill applications, and chip on board encapsulations. Cures at 185°F. Reliable electrical insulator, Used as a barrier to block flow. Thermally conductive, electrically isolating, paste consistency.
Toughened epoxy paste system for damming applications. Requires no mixing. Rapid heat curing. Passes NASA low outgassing testing. Transfers heat efficiently. Stellar electrical insulation properties. Serviceable from -100°F to +400°F.