Glob Top Epoxy Compounds

Master Bond’s unique glob top compounds are ideal for the encapsulation of semiconductor chips and wire bonds mostly in chip on board (COB) applications. These formulations offer protection against moisture, chemicals and contaminants. Additionally, they minimize the thermal mismatch between chips and substrates. They also provide mechanical support and electrically insulative properties.

Types of Glob Top Coatings

  • One component epoxies
  • Two component epoxies
  • UV curing systems

Benefits of Master Bond Glob Top Coatings

    dam-and-fill method of glob top encapsulation
  • Low stress
  • Low outgassing
  • Low shrinkage
  • Easy application
  • High purity
  • Fast cure speeds
  • Special flow properties

Master Bond’s Most Popular Glob Top Formulations

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