Master Bond's product line features many epoxy systems that conform to Title 21, U.S. Code of Federal Regulations, FDA Chapter 1, Section 175.105 requirements for food safety. Specific formulations have also been independently tested and passed stringent FDA CFR 175.300 specification and the NSF/ANSI 51.4.1 (2009) standard for food applications.
FDA Certified Adhesives for Food Processing Equipment Manufacturing
These highly specialized formulations are designed for manufacturing companies, R&D labs and other organizations. We do not sell our products for personal use applications. Master Bond products are not available for purchase on our website, e-commerce sites or in retail stores.
Properties of Food Grade Systems
These high performance polymers may be used across a wide variety of applications in the food industry and offer many beneficial characteristics including:
- Excellent resistance to chemicals such as boiling water, fats, oils, acids, alkalis and many solvents
- Capable of withstanding extreme temperature conditions
- Resists steam, radiation and frozen storage conditions
- Contains no solvents or diluents
- Convenient handling
Our Most Popular Food Safe Epoxy Adhesives
Food grade epoxy system toxicologically evaluated to meet the NSF/ANSI 51.4.1 (2009) standard for food equipment materials. Certified to meet FDA CFR 175.300. Excellent resistance to fats, oils, acids, alkalis and many solvents. Withstands boiling water, radiation, chemicals, steam and frozen storage conditions. Strong bonds to similar/dissimilar substrates. Service temperature range -60°F to +450°F. Low viscosity.
High temperature resistant, room temperature curing epoxy system. Exceptional bond strength and dimensional stability. Optically clear. Meets FDA Chapter 1, Section 175.105 requirements. Easy to apply. Serviceable from -60° to +400°F. Protects against exposure to water, oils, fuels, acids, bases and many solvents. Rigid system. Impressive electrical insulation values.
High performance epoxy adhesive, sealant and coating. Superior physical strength properties. Bonds well to similar and dissimilar substrates. Conforms to FDA Chapter 1, Section 175.105 specification for indirect food contact. Solvent free system. Optically clear. Rigid bonds. Outstanding chemical resistance. Room temperature curing. Serviceable from -60°F to +300°F.
Two component room temperature curing epoxy adhesive, sealant, coating. Moderate viscosity. Forgiving one to one mix ratio weight or volume. Formidable bond strength. Can be used for indirect food contact applications as per FDA 175.105 specifications. Serviceable from -60°F to +400°F.