We offer an extensive variety of high performance adhesives, sealants, coatings, potting and encapsulation compounds for aerospace and defense electronic applications. Technologically advanced formulations are designed to withstand high and low temperature exposure, vibration, impact, chemicals and thermal cycling. Additionally, specific grades are NASA low outgassing approved and meet the requirements of UL 94V-0 for flame retardancy.
Types of Master Bond Compounds for the Aerospace and Defense Electronic Industry
From sensors and heat transfer devices to guidance and communication systems, Master Bond products offer reliable solutions to challenging specifications. Our formulations include:
- Electrically conductive systems
- Thermally conductive pastes
- Electrically insulative pastes
- Conformal coatings
- Potting compounds
- Underfill encapsulants
Properties of Compounds for Aerospace and Defense Electronic Applications
Epoxy, silicone, polyurethane, polysulfide and UV cure systems are available to meet specific end use requirements. These include:
- Low coefficient of thermal expansion (CTE)
- Low stress
- Cryogenic serviceability
- Ultra low moisture absorption
- Special flow properties
- High glass transition temperature (Tg)
- Low outgassing
- High purity
Most Popular Products for Aerospace and Defense Electronics
Silver conductive, room temperature curing epoxy adhesive meets NASA low outgassing specifications. Serviceable from 4K to +275°F. High bond strength properties. Withstands thermal cycling. Outstanding toughness. Volume resistivit <10-3 ohm-cm. Paste viscosity. Convenient one to one mix ratio by weight or volume.
Thermally conductive and electrically insulative, one part epoxy adhesive. Superior toughness and dimensional stability. Bonds are resistant to thermal cycling and many chemicals. Serviceable from 4K to +400°F. NASA low outgassing approved. Withstands 1,000 hours 85°C/85% RH. Impressive physical strength properties.
Durable potting, encapsulation, casting compound meets UV 94V-0 flame retardant specifications. Convenient one to one mix ratio by weight. Features a non-halogen filler. Superb flow properties. Outstanding electrical insulation. Low smoke generation. Serviceable from -51°C to +90°C.
Optically clear, easy to apply UV curable system. Meets NASA low outgassing specifications. Superior electrical insulative properties. High physical strength properties and superior chemical resistance. Vacuum compatible. Serviceable from -60°F to +400°F
Thermally conductive epoxy. Can be applied in sections as thin as 5-10 microns. Excellent flow properties. Service temperature range -100°F to +300°F. High compressive strength. Outstanding electrical insulation characteristics. Passes NASA low outgassing tests. Low CTE.
Thermally conductive, electrically insulative. Outstanding dimensional stability. Passes NASA low outgassing tests. Very long open time. Paste consistency. Ideally suited for potting applications. Serviceable from -80°F to +550°F. Black in color. Requires oven curing.