Master Bond's thermally conductive adhesives offer superior heat dissipation for a wide range of electronic applications. Both one and two component systems are available for use. They include epoxies, silicones and elastomeric products. Special formulations designed for unusual service conditions are also available.
Performance Properties of Master Bond's Thermally Conductive Compounds
Master Bond is at the forefront of developing thermally conductive compounds with superior performance properties for challenging electronic applications. Among the most important properties are:
- Superior electrical insulation
- Chemical resistance
- Vibration and impact resistance
- Cryogenic serviceability
- NASA low outgassing approval
- Halogen free
Master Bond has also developed products with enhanced heat dissipation properties that also offer electrical conductivity. Most noteworthy are nickel, silver coated nickel and silver filled products. These compounds contain a variety of fillers in different particle sizes and are designed for easy dispensing with standard application equipment.
Common Applications Featuring Thermally Conductive Adhesives
Thermally conductive formulations are used for bonding, potting and encapsulation applications in a wide variety of industries. Some specific applications include:
- Heat sink bonding
- Potting/encapsulating sensors
- BGA die heat spreader interface
- Chip scale packages
- Power semiconductors
Learn more about how thin bond lines improve heat transfer properties
Our Most Popular Thermally Conductive Adhesive Formulations
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FLM36 B-staged film adhesive/sealant. Outstanding thermal cycling capabilities and structural properties. Offers superior toughness and flexibility. Excellent strength retention at elevated temperatures. Thermally conductive/electrically insulative. Provides uniform bond line thickness. Serviceable from -100°F to +500°F. Preforms are available. |
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Super Gel 9 Two part, room temperature curing, epoxy gel compound for sealing and encapsulation. Optically clear, soft and dimensionally stable. Ideal for retrievability. Two to one mix ratio by weight or volume. Low exotherm. Long working life. Low viscosity system. Unsurpassed thermal cycling and mechanical shock resistance. Used in conjunction with sensitive electronic and optical components. Serviceable from -100°F to +200°F. |
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EP30AN-1 Thermal conductive/electrically insulative epoxy cures at room temperature. Outstanding heat dissipative properties. Serviceable from -60°F to +250°F. Low viscosity. Suitable for potting/encapsulation. NASA approved for low outgassing. |
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EP37-3FLFAO Flexible, low viscosity, thermally conductive epoxy. Meets NASA low outgassing specifications. Superb electrical insulator. Good physical strength. Chemical resistant. Long working life. Withstands 1,000 hours 85°C/85% RH. Guards against mechanical shock and vibration. Excellent flowability. Ideal for potting and casting. |
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EP21TDCANHT Features exceptional thermal conductivity. High dielectric strength. Idea for joining dissimilar substrates. Serviceable from -100°F to +400°F. Superior durability. Will cure at room temperature. |
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EP21TCHT-1 Two part, room temperature curable epoxy system with high thermal conductivity. Serviceable from cryogenic temperatures up to +400°F. Electrically isolating. Meets NASA low outgassing specifications. Halogen free. Paste consistency. Formulated to cure at ambient temperatures. Withstands 1,000 hours 85°C/85% RH. |
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Supreme 10AOHT One part, oven cured epoxy system with excellent thermal conductivity and superb resistance to thermal cycling. Primarily used for bonding of heat sinks and sensors where heat transfer is desirable. Halogen free. Serviceable from 4k to +400°F. Convenient processing. |
