Electrically insulative epoxy paste and B-staged preform adhesives provide cost effective alternatives to seam welding, soldering or glass attachment in lid sealing applications. They also offer low temperature processing and avoidance of metal particle contamination. These compounds feature high bond strength, thermal stability and superior protection against moisture. Preform systems cure rapidly at moderate elevated temperatures, have controllable flow and long storage stability.
Most Popular Lid Sealing Epoxies
Cures rapidly at moderate elevated temperatures. Superior resistance to moisture. Two part epoxy has long pot life at ambient temperatures. High bond strength properties. Reliable electrical insulator. Serviceable from -60°F to +450°F. Withstands aggressive chemical exposure. Tg 160-165°C. Shore D hardnes >80.
High performance, thermally conductive, electrically insulative, resin based epoxy adhesive film system. Offers superior mechanical strength, convenient handling, good storage stability and fast cures at moderate temperatures. Uniform bond line thickness. Special preforms can also be prepared in multiple shapes and sizes. Serviceable from -100°F to +400°F.