Bonding plastic parts is increasingly recognized as a major challenge in many assembly operations. Master Bond has developed a comprehensive line of adhesive systems designed to bond plastic substrates to each other, as well as to metal, rubber, ceramic and glass.
Bonding Plastic Parts
Different compounds are available to bond specific plastics, including:
- Polyphenylene Sulfide
- Polycarbonate (PC)
- Thermoplastic Polyurethanes (TPUs)
- Diallyl Phthalate (DAP, DAIP)
- Liquid Crystal Polymer (LCP)
- Polyphenylene Oxide (PPO)
- Polyurethane (PU)
- Polyvinyl Chloride (PVC)
Learn more about plastic bonding adhesive properties and applications.
Some of Our Most Popular Systems for Plastics Bonding
Epoxy adhesive, sealant, coating resists acids, alkalis and many solvents. Low viscosity room temperature curing. Contains no solvents. Serviceable from -60°F to +300°F. Castable to thicknesses exceeding 2-3 inches. Excellent electrical insulator.
Two part, room temperature curing epoxy system with excellent optical transparency. Low viscosity. Bonds extremely well to more sensitive plastics such as polycarbonates and acrylics. Superior electrical insulation properties. Good chemical resistance to oils, fuels, water, hydraulic fluids. Serviceable from -60°F to +250°F.
Fast setting. Viscosity 2,000 - 2,400 cps. Biocompatible. Resists EtO and gamma sterilization. Passes USP Class VI testing. Bonds well to metals, plastics, rubbers, glass. Serviceable from -60°F to +250°F.
Two part epoxy requiring moderate heat curing (80-120°C). Meets USP Class VI biocompatibility specifications. Superb resistance to repeated autoclaving along with excellent adhesion to high temperature plastics such as Ultem, PEEK, etc. Exceptionally long working life. Outstanding electrical insulation properties. Serviceable from -60°F to +450°F.
One part, oven curing epoxy system with very good adhesion to a wide range of plastics. Especially well suited for bonding dissimilar plastic materials. Resists -100°F to +350°F. Exceptional toughness. Successfully tested for 1,000 hours at 85°C/85% RH.
One part, no mix, fast curing compound. Tack free cure. High bond strength to a wide range of substrates. Solvent free formulation. Withstands 1,000 hours 85°C/85% RH. Serviceable from -60°F to +250°F.
Excellent adhesion to metals and engineering plastics such as polycarbonates, acrylics. Flexible. Low to moderate viscosity bonding, potting, sealing, encapsulation compound. High shear/peel strength. Resists mechanical shocks and vibration. Moderately low exotherm during cure. Serviceable from -80°F to +250°F.
Excellent adhesion to metals and engineering plastics such as polycarbonates, acrylics. Flexible. For bonding, potting, sealing compound. High shear/peel strength. Resists mechanical shocks and vibration. Moderately low exotherm during cure. Serviceable from -100°F to +250°F. Paste consistency.