Technologically advanced adhesives, sealants, coatings, potting and encapsulation compounds have been developed to meet the increasingly challenging requirements of manufacturers of medical diagnostic equipment. These formulations feature high bond strength to similar and dissimilar substrates, offer high/low temperature resistance, withstand exposure to moisture and chemicals and have long-term durability. Specific grades are electrically conductive, thermally conductive, USP Class VI approved, NASA low outgassing certified and optically clear.
Master Bond adhesives adhere to a wide range of materials, including metals, various plastics, ceramics, glass and composites. They are used for structural bonds as well as potting/gap-filling applications, and offer versatility for the many types of technologies within the medical diagnostics space. Epoxies and silicones have become integral to manufacturing these diagnostic medical devices, and provide versatile properties to meet specific market needs.
Types of Medical Diagnostic Equipment Using Master Bond Compounds
- MRI machines
- PET and CT scanners
- Ultrasound machines
- Electrocardiograph devices
- X-ray machines
Most Popular Products for Medical Diagnostic Equipment
Two component, room temperature curing, radiopaque epoxy adhesive, sealant and coating. Employed for medical diagnostic and therapeutic devices. Effective for even 100 KV, px-ray (peak x-ray) machines and higher energy capacities. Convenient one to one mix ratio. High bond strength. Superior electrical insulation properties. Serviceable from -60°F to +250°F.
USP Class IV approved, heat resistant epoxy adhesive. Glass transition temperature in excess of 220°C. Withstands repeated exposure to autoclaving, radiation and chemical sterilants. High bond strength. Superior durability. Serviceable from -100°F to +500°F. Electrically insulative SUitable for potting.
Medical grade, USP Class VI approved silicone. Addition type cure system. Optically clear. Low outgassing. Offers ambient or elevated temperature cures. Excellent for potting and encapsulation applications. Low shrinkage upon cure. Resists gamma radiation, EtO and various chemical sterilants. Serviceable from -65°F to +400°F.
Low viscosity epoxy adhesive, sealant, coating and casting compound. USP Class VI approved. Resists vibration, impact, shock., thermal cycling. Ideally suited to bond dissimilar substrates. Serviceable from -80°F to +250°F. Withstand exposure to EtO, radiation and chemical sterilants. Excellent toughness.