Master Bond’s dimensionally stable systems are designed for long-term durability and high performance even in extreme environmental conditions. These formulations consist of epoxies, silicones, polyurethanes, polysulfides and UV curable systems.
Applications of Dimensionally Stable Adhesives and Potting Compounds
Master Bond's dimensionally stable systems are employed in many high tech industries. They can be used in a variety of applications, including:
- Semiconductor assembly
- Optoelectronic packaging
- Industrial switchgear applications
- Potting of high voltage sensors
Some of Our Most Popular Dimensionally Stable Epoxy Adhesives
Thermally conductive and electrically insulative, one part epoxy adhesive. Superior toughness and dimensional stability. Bonds are resistant to thermal cycling and many chemicals. Serviceable from 4K to +400°F. NASA low outgassing approved. Withstands 1,000 hours 85°C/85% RH. Impressive physical strength properties.
Thermally conductive/electrically insulative epoxy. Two part system cures at ambient temperatures. Has convenient one to one mix ratio by weight or volume. Excellent heat transfer characteristics. High bond strength. Shore D hardness 85-90. Low coefficient of expansion. Serviceable from -60°F to +250°F.
One component, heat curable epoxy adhesive. Serviceable from -60°F to +500°F. Paste viscosity. High tensile shear and compressive strength. Chemical resistant. Machinable.
Low viscosity two part high performance epoxy resin system. High strength rigid bonds. Low linear shrinkage after cure. Superb optical clarity and light transmission properties. Serviceable from -60°F to +250°F. Cures readily at room temperature. Withstands 1,000 hours 85°C/85% RH.