Dimensionally Stable Epoxies

Master Bond’s dimensionally stable systems are designed for long-term durability and high performance even in extreme environmental conditions. These formulations consist of epoxies, silicones, polyurethanes, polysulfides and UV curable systems.

Applications of Dimensionally Stable Adhesives and Potting Compounds

Master Bond's dimensionally stable systems are employed in many high tech industries. They can be used in a variety of applications, including:

  • Semiconductor assembly
  • Optoelectronic packaging
  • Industrial switchgear applications
  • Potting of high voltage sensors

Utilization of these products has enabled end users to ensure exact positioning/alignments improving quality, enhancing dependability under demanding conditions. Most importantly, filled epoxy adhesive systems have a low degree of shrinkage in comparison to other adhesive systems. While unfilled systems have proven successful in offering low shrinkage, often inorganic fillers have been incorporated in epoxy adhesives to lower shrinkage further. Consideration of stress from thermal expansion mismatches is another factor of significance when selecting a dimensionally stable adhesive.

The table below illustrates the coefficient of thermal expansion, hardness and service temperature range properties that can be achieved for the systems noted:
System Type Product CTE, 75°F, x 10-6 in/in/°C Shore D Hardness, 75°F Service Temperature Range
Two part epoxy EP30LTE-LO 15-18 85-95 4K to 250°F (4K to 121°C)
One part UV cure UV22DC80- 10F 30-35 75-85 -60°F to 350°F (- 51°C to 177°C)
Two part epoxy EP21TCHT-1 18-21 85-95 4K to 400°F (4K to 205°C)
Two part epoxy EP30-2 40-45 80-90 4K to 300°F (4K to 149°C)
Two part epoxy EP30NS 30-35 80-90 -60°F to 300°F (-51°C to 149°C)

Some of Our Most Popular Dimensionally Stable Epoxy Adhesives

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