One and two part systems feature high electrical conductivity and superior shielding protection. Environmentally friendly, these products offer resistance to heat and humidity. They are easy to apply and offer convenient cure schedules at room temperature.
Common Applications for Master Bond's EMI/RFI Coatings
- Industrial equipment
- Consumer electronics
- Medical devices
- Cell phones
- Office equipment
- Military devices
These compounds are designed to maximize cost effectiveness and protection against corrosion. They bond well to many metal and plastic substrates including:
Benefits of Master Bond's EMI/RFI Coatings
Greater use of plastic enclosures/housings in manufacturing digital electronic devices has increased the need for reliable EMI/RFI coating solutions. A range of compounds have been developed that offer different conductive fillers to provide numerous resistance and attenuation levels. These systems can be applied by brushing and conventional spray techniques.
- Protect electronic devices from electromagnetic pulses
- Superior shielding performance
- Minimal tack free time
- Cost effective alternative to other shielding methods
- Provide uniform thickness
- Exceptional point to point resistivity
- For high and low volume applications
Master Bond's Most Popular EMI/RFI Coatings
Graphite filled epoxy that cures at 80°C. Good electrical and thermal conductivity. Passes ISO 10993-5 certification. Can be used for bonding, sealing, coating. Service temperature range is -50°C to +175°C
One component, silver filled epoxy for bonding, sealing and coating. It is low in viscosity and flows smoothly and easily. Not premixed and frozen and has a working life of 8-12 hours; it will not cure until heated. Cure schedule is simple and straightforward, 60 to 90 minutes at 80°C.
Aqueous based sodium silicate system. One component, silver filled formulation. Highly effective moisture barrier. Bonds well to a wide variety of substrates. Temperature resistance up to 700°F. Excellent shielding effectiveness. Simple, safe handling.
Highly flexible, silver coated/nickel filled epoxy system. T-pee >20 pli. Low volume resistivity. High bond strength to similar and dissimilar substrates. Resists exposure to thermal cycling. Serviceable from 4k to +275°F. One to one mix ratio by weight. Ambient temperature curing. 100% reactive. Withstands moisture, chemical exposure. Available in premixed and frozen syringes.