One part, no mix systems feature high electrical conductivity and superior shielding protection. Environmentally friendly, these products offer resistance to heat and humidity. They are easy to apply and offer convenient cure schedules at room temperature.
Common Applications for Master Bond's EMI/RFI Coatings
- Industrial equipment
- Consumer electronics
- Medical devices
- Cell phones
- Office equipment
- Military devices
These compounds are designed to maximize cost effectiveness and protection against corrosion. They bond well to many metal and plastic substrates including:
Benefits of Master Bond's EMI/RFI Coatings
Greater use of plastic enclosures/housings in manufacturing digital electronic devices has increased the need for reliable EMI/RFI coating solutions. A range of compounds have been developed that offer different conductive fillers to provide numerous resistance and attenuation levels. These systems can be applied by brushing and conventional spray techniques.
- Protect electronic devices from electromagnetic pulses
- Superior shielding performance
- Minimal tack free time
- Cost effective alternative to other shielding methods
- Provide uniform thickness
- Exceptional point to point resistivity
- For high and low volume applications
Master Bond's Most Popular EMI/RFI Coatings
Silver filled electrically conductive epoxy adhesive has a rapid cure speed. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive. Smooth paste, consistency. Dispensible from syringe applicator. Serviceable from -60°F to +400°F.
Aqueous based sodium silicate system. One component, silver filled formulation. Highly effective moisture barrier. Bonds well to a wide variety of substrates. Temperature resistance up to 700°F. Excellent shielding effectiveness. Simple, safe handling.
Thermally conductive and electrically isolating. Easy to use silicone for high performance bonding, sealing and coating. Non-corrosive and room temperature curable. Ideally suited for applications requiring flexibility and high temperature resistance.
Easy to use, nickel filled elastomeric adhesive. No mix system. Good electrical conductivity. Used for shielding. Room or elevated temperature curing. Withstands thermal cycling. Serviceable from -80°F to +250°F.