Master Bond two part epoxy EP62-1AO resists acids, bases and solvents while maintaining excellent strength properties.
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Most effective underfill epoxies such as EP29LPTCHT have low viscosities and feature high dimensional stability as well as a low coefficient of thermal expansion.
Master Bond EP21TPHT is an epoxy polysulfide compound that withstands temperatures up to 350°F - giving it a higher resistance to elevated temperatures than most polysulfide systems.
Ideal for potting and encapsulation applications, Master Bond Supreme 121AO is a heat curing epoxy featuring excellent thermal conductivity and high temperature resistance. Scroll through this infographic to learn more.
Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses.
Master Bond Supreme 11HT-3A epoxy features high performance properties including thermal cycling and high temperature resistance. This two part system is easy to handle with a convenient mix ratio and a long open time.