Low CTE Adhesives

Selecting an adhesive with a low coefficient of thermal expansion (CTE) is one of the approaches to improve the bond strength and stability between dissimilar substrates. Low CTE adhesives mitigate the mismatch in thermal expansion between the substrates being bonded, as well as between the substrates and the adhesive.

One and two component advanced epoxy systems have been developed for joining dissimilar substrates exposed to thermal/mechanically induced stresses. These dimensionally stable, low shrinkage compounds which are formulated with select fillers offer extra low coefficients of thermal expansion. Products provide the integrity of bonded joints even from high/low temperature exposure. Grades consist of electrically insulative and thermally conductive/electrically isolating systems. They are available for use in a variety of viscosities. NASA low outgassing approved systems meet ASTM E595 requirements for critical aerospace, optical, electronic and specialty OEM needs. Select products have been employed as thermal interface materials to optimize heat transfer and improve device reliability.

CTE Testing Results

Product CTE ppm/°C @ 23°C Tg Service Temperature Range
EP42HT-2LTE 9-12 60-70°C 4K to +300°F (4K to +149°C)
EP30LTE-2 10-13 85-95°C -100°F to +250°F (-73°C to +121°C)
EP42HT-3AO 10-20 140-145°C -100°F to +400°F (-73°C to +204°C)
EP13LTE 15-20 160°C -60°F to +500°F (-51°C to +260°C)

Common Materials: Typical CTE Range for Comparison
Material CTE ppm/°C @ 23°C
Ceramics 0 - 10
Metals 10 - 30
Plastics 40 - 120
Rubbers 100 - 300 or higher

Most Popular Low Coefficient of Thermal Expansion Epoxies

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