Low temperature heat curing one part epoxy systems are formulated to cure at temperatures from 175 to 210°F (80° to 100°C). These systems are well suited for bonding heat sensitive substrates and engineered to fit other application requirements, such as:
- Bonding similar/dissimilar substrates with CTE differences
- Minimizing thermal stress
- Preventing warpage, cracking during temperature fluctuations.
Advantages and trade-offs of one part low temperature heat curing epoxies
These formulations offer all traditional advantages of all one component epoxies, as they require no mixing is required prior to use and their working life is unlimited. Unlike premixed and frozen systems which require special low temperature storage, they can be conveniently stored in conventional refrigerators or at ambient temperatures.
All epoxy adhesives reach their peak performance property values after longer exposure to heat at higher temperatures. Adhesive Academy: Heat Curing 101 and Heat Curing 102 videos cover this subject in more details. Although optimal properties are obtained with the higher temperature cure, the lower curing temperature still provides reasonably good physical strength and electrical insulation values. To These systems are compounded to cure at the lowest temperatures for the shortest time periods to facilitate rapid production speeds.
Example: Typical Properties of Master Bond Supreme 3HT-80
|Tensile lap shear strength, aluminum to aluminum, 75°F||30 minute cure at 175°F||600-800 psi|
|Tensile lap shear strength, aluminum to aluminum, 75°F||30 minute cure at 250°F||2,000-2,200 psi|
|Tensile strength, 75°F||30 minute cure at 175°F||3,000-4,000 psi|
|Tensile strength, 75°F||30 minute cure at 250°F||7,000-8,000 psi|
|T-peel strength, aluminum to aluminum, 75°F||30 minute cure at 175°F||5-10 pli|
|T-peel strength, aluminum to aluminum, 75°F||30 minute cure at 250°F||20-25 pli|
Only thorough examination of all application requirements can determine suitability of a particular adhesive compound.
Benefits of two part low temperature heat curing epoxies
Select two component epoxy systems offer exceptionally long working life after mixing and cure at moderately elevated temperatures. For example, Master Bond EP62-1 features a greater than 12 hour working life for a 100 gram batch.
Most Popular Low Temperature Heat Curing Adhesives, Sealants, Coatings, Potting and Encapsulation Compounds
High performance one part epoxy. Good flow properties. Thermally conductive, electrically insulative. Service temperature range -100°F to +500°F. Can be cast in thicknesses up to 1/2 inch. High dimensional stability.
UV and heat curable epoxy formulation. Cures in "shadowed out" areas at temperatures as low as 80°C. Passes 1,000 hours at 85°C/85% humidity. Convenient no mix system. Serviceable from -60°F to +350°F. Superb electrical insulator.
Fast cures at ambient 175°F (80°C). Recommended for bonding heat sensitive substrates. Outstanding thermal cycling capabilities. Single part no mix system. Serviceable from -100°F to +350°F. Tough and durable. Withstands 1,000 hours at 85°C/85% RH.