Low temperature heat curing one part epoxy systems are formulated to cure at temperatures from 175 to 210°F (80° to 100°C). These systems are well suited for bonding heat sensitive substrates and engineered to fit other application requirements, such as:
- Bonding similar/dissimilar substrates with CTE differences
- Minimizing thermal stress
- Preventing warpage, cracking during temperature fluctuations
Advantages and trade-offs of one part low temperature heat curing epoxies
These formulations offer all traditional advantages of all one component epoxies, as they require no mixing is required prior to use and their working life is unlimited. Unlike premixed and frozen systems which require special low temperature storage, they can be conveniently stored in conventional refrigerators or at ambient temperatures.
All epoxy adhesives reach their peak performance property values after longer exposure to heat at higher temperatures. Adhesive Academy: Heat Curing 101 and Heat Curing 102 videos cover this subject in more details. Although optimal properties are obtained with the higher temperature cure, the lower curing temperature still provides reasonably good physical strength and electrical insulation values. These systems are compounded to cure at the lowest temperatures for the shortest time periods to facilitate rapid production speeds.
Example: Typical Properties of Master Bond Supreme 3HT-80
|Tensile lap shear strength, aluminum to aluminum, 75°F||30 minute cure at 175°F||600-800 psi|
|Tensile lap shear strength, aluminum to aluminum, 75°F||30 minute cure at 250°F||2,000-2,200 psi|
|Tensile strength, 75°F||30 minute cure at 175°F||3,000-4,000 psi|
|Tensile strength, 75°F||30 minute cure at 250°F||7,000-8,000 psi|
|T-peel strength, aluminum to aluminum, 75°F||30 minute cure at 175°F||5-10 pli|
|T-peel strength, aluminum to aluminum, 75°F||30 minute cure at 250°F||20-25 pli|
Only thorough examination of all application requirements can determine suitability of a particular adhesive compound.
Benefits of two part low temperature heat curing epoxies
Select two component epoxy systems offer exceptionally long working life after mixing and cure at moderately elevated temperatures. For example, Master Bond EP62-1 features a greater than 12 hour working life for a 100 gram batch.
Most Popular Low Temperature Heat Curing Adhesives, Sealants, Coatings, Potting and Encapsulation Compounds
Fast cures at ambient 175°F (80°C). Recommended for bonding heat sensitive substrates. Outstanding thermal cycling capabilities. Single part no mix system. Serviceable from -100°F to +350°F. Tough and durable. Withstands 1,000 hours at 85°C/85% RH.
Dual cure system with UV and heat curing mechanisms. Cures at 80°C in shadowed out areas. Nano filled, high dimensional stability and abrasion resistance. Bonds well to metals, glass, ceramics and most plastics. Serviceable from -60°F to +350°F.
One component, low viscosity epoxy primarily for underfill applications. Not premixed and frozen, with unlimited working life at room temperature. Cures at elevated temperatures with a minimum of 80°C. The service temperature range is -50°C to +150°C.
One component epoxy for bonding, sealing and small encapsulation applications. High thermal conductivity and electrical insulation properties. Paste consistency epoxy featuring ultra fine particles filler material that allows application in very thin sections. High compressive strength, tensile modulus and dimensional stability. Serviceable from -50°C to +175°C.
One part epoxy system designed for glob tops and small encapsulation. Curing temperature 175-185°F for 2 to 3 hours. Toughened epoxy can withstand thermal cycling. Suitable for bonding and potting. Thermally conductive and electrically insulative. Service temperature range from -100°F to +350°F.
Graphite filled epoxy that cures at 80°C. Good electrical and thermal conductivity. Passes NASA low outgassing certification. Can be used for bonding, sealing, coating. Service temperature range is -50°C to +175°C