Die Attach Epoxy Adhesives for ElectronicsMaster Bond's advanced die attach adhesives are increasingly accepted for demanding microelectronic semiconductor packaging as well as for chip on board assemblies. They offer outstanding bond strength for adhering components directly onto printed circuitry. These systems are presently employed in the assembly of many critical electrical devices used in commercial, military, space and medical applications.

Types of Die Attach Epoxies

Master Bond die attach adhesives are available in one component heat curing formulations and as B-staged epoxy films. They are designed to cure quickly for high volume production.

Outstanding Physical Properties of Die Attach Adhesives

Our high performance die attach compounds have many advantages, including:

  • Excellent resistance to thermal cycling
  • Mechanical shock and vibration resistant
  • 100% reactive; they do not contain any volatiles
  • Dimensional stability
  • Low ionic impurities
  • Adhesion to mismatched coefficients of thermal expansion
  • Adjustable volume resistivity
  • Void free uniform bond lines
  • Low humidity sensitivity
  • Advanced heat dissipation characteristics.

Our ROHS compliant compositions can be used with a wide range of die sizes and exhibit outstanding die shear strength as shown in the following table.

Die Shear Strength Testing Results for Thermally Conductive Adhesives
System Type Product Electrical Conductivity Die Shear Strength
@ 75°F 2x2 mm (80x80 mil)
Epoxy film FL901AO Electrically insulative 40-42 kg-f
One part epoxy EP17HTDA-1 Electrically insulative 24-27 kg-f
One part epoxy Supreme 3HTND-2DA Electrically insulative 19-21 kg-f
Epoxy film FL901S Electrically conductive 24-26 kg-f
One part epoxy EP3HTSDA-1 Electrically conductive 20-22 kg-f
One part epoxy EP3HTSDA-2 Electrically conductive 20-22 kg-f

Die Shear Test Method

A small die is carefully mounted/attached on a lead frame with the help of an adhesive. The adhesive is typically dispensed (if liquid) or die cut and applied on the lead frame first. After mounting the die on the substrate, the adhesive is cured using the recommended cure schedule on the data sheet. Following this, a load applying instrument tries to shear (remove) the die from the lead frame by applying a force parallel to the lead frame (substrate). The point at which the die shears or breaks with the lead frame is then noted. This force is measured in kg-force needed to break the adhesive bond.

Die Attach Compounds Come in Convenient Packaging

These high performance epoxies can be readily dispensed by syringes and other conventional devices as well as by specialized printing technologies.

Some of Our Most Popular Die Attach Materials

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