Designed to improve reliability, Master Bond’s line of epoxy underfill compositions offer excellent underfill to die passivation as well as outstanding adhesion to a variety of substrates. They improve mechanical support, lower strain on solder joints and provide superior protection from moisture.
Applications for Epoxy Underfill Encapsulants
- Flip chip devices
- Ball grid arrays
- Chip scale packaging
Advantages of Master Bond Underfill Systems
Both flowable and non-flow systems are available for use. Additionally, to improve efficiency of production snap cure and reworkable systems have been introduced. The key properties of theses systems include:
- High purity
- Low stress
- High adhesion
- Low coefficient of thermal expansion (CTE)
- Low outgassing
- High glass transition temperature (Tg)
- High Young’s modulus
- Moisture resistance
- Short cure cycle
- Structural stability
- Thermal cycling resistance
- Shock and vibration resistance
Our Most Popular Flip Chip Underfill Systems
One part oven cured system (125-150°C) for potting, encapsulation and underfill applications. Good dimension stability and very easy to use. Cures rigid. Thermally conductive/electrically insulative. Excellent flow properties. Superior mechanical strength. Can be cast up to 1 inch thick. Withstands 1,000 hours 85°C/85% RH. Serviceable from -60°F to +350°F.
Low viscosity, thermally conductive potting, bonding and sealing compound. Cures at room temperature. Superior electrical insulation properties. High compressive strength. Rigid bonds. Low thermal expansion coefficient. Excellent dimensional stability. Withstands 1,000 hours 85°C/85% RH. Serviceable from -60°F to +250°F.
Highly flexible, low viscosity, optically clear adhesive. Resistant to severe thermal cycling and thermal shock. Bonds well to dissimilar substrates. Low exotherm system. Long working life. Superior electrical insulation properties. Service temperature range from 4K to +250°F. One to one mix ratio by weight or volume.