One part epoxy systems require no mixing and simplify processing. These products are available in liquid, paste and solid (such as films/performs) forms. Thermal curing, UV light cure and dual UV/heat curing systems are compounded to meet demanding specifications.
One part epoxy compositions are designed to eliminate waste, accelerate productivity while alleviating concerns regarding mix ratios, weighing, working life and shelf life.
Common Applications of One Component Epoxy Systems
Specially formulated one component epoxy systems feature outstanding performance properties, long-term durability and easy application. These no mix compounds are employed in the electronic, aerospace, medical, electrical, automotive, oil/chemical processing and optical industries.
Curing Mechanisms of One Part Epoxy Systems
In thermal curing epoxies latent curing agents are blended into epoxy resin single component formula so that shelf life stability is maintained before heat activation at specified temperature.
- Heat cure. Most one part systems require a temperature of 125°C to 150°C for curing. They fall into three categories based on temperature and curing time: conventional, fast and snap curing.
- Low temperature heat cure (80°- 100°C). Read more about low temperature heat curing epoxies.
- B-staged epoxy systems have been partially cured and are solid at room temperature. They can be liquefied and fully cured at higher temperatures. Read more about B-stages epoxy systems.
For UV light curing epoxies, the reaction is activated by a suitable light source at the proper intensity and wavelength. This type of systems offers fast cure speeds and lower energy consumption.
- UV light cure. Read more about UV light curing epoxies.
- Dual cure: UV and heat. Read more about dual curing adhesives.
Premixed and frozen epoxies are thoroughly blended two component systems that are packaged in single part cartridges or syringes. These systems cure at room temperatures. Read more about premixed and frozen epoxies.
Special Certifications for One Part Epoxy Compounds
Many of Master Bond’s one part adhesives, sealants and coatings are approved for use in various applications and industries. Additionally, specific grades meet the following certifications:
- NASA low outgassing
- USP Class VI for biocompatibility
- Halogen free
- Select products have been tested for 1000 hours at 85°C/85% RH.
As with all products in the Master Bond family, specific grades vary in viscosity, cure speed, chemical resistance and electrical properties, but can be custom formulated to meet your application needs. Our wide range of one component systems can be used for bonding, sealing, coating, potting, encapsulation and impregnation applications. Specific grades offer:
- High temperature resistance
- Cryogenic serviceability
- Electrical conductivity or insulation
- Optical clarity
- Thermal conductivity
- Flexibility and toughness
- High bond strength to similar and dissimilar substrates
Some Popular One Part Epoxy Adhesives, Sealants, Coatings and Potting Compounds
One part, no mix epoxy meets NASA low outgassing specifications. Serviceable up to 600°F. Tg is 225°C. High shear, tensile and compressive strength properties. Cures in 90-120 minutes at 300F. Withstands 1000 hours 85°C/85% RH.
No mix compound has exceptional tensile strength properties. Superior dimensional stability. Used for testing the adhesion and/or cohesive strength of flame sprayed coating per ASTM C633. Low shrinkage upon cure. Viscosity 40,000-65,000 cps. Serviceable from -60°F to +250°F.
Fast cures at ambient 175°F (80°C). Recommended for bonding heat sensitive substrates. Outstanding thermal cycling capabilities. Single part no mix system. Serviceable from -100°F to +350°F. Tough and durable. Withstands 1,000 hours at 85°C/85% RH.
Rapid curing, one part epoxy. Meets USP Class VI biocompatibility standards. Thixotropic paste viscosity. High shear strength. Superb resistance to autoclaving, chemical sterilants, radition, EtO. Serviceable from -60°F to +400°F.
Thermally conductive version of our one part Supreme 10HT epoxy system with excellent heat transfer properties. Outstanding bond strength. Thermal conductivity 20-25 BTU ·in/ft2 ·hr/°F. Serviceable from 4k to +400°F. Superior durability. Versatile cure schedule at elevated temperatures. Can withstand prolonged exposure to water, fuels, oil, organic solvents. Gray color.
Silver filled electrically conductive epoxy adhesive has a rapid cure speed. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive. Smooth paste, consistency. Dispensible from syringe applicator. Serviceable from -60°F to +400°F.
One component flowable paste epoxy for bonding, sealing and small encapsulation applications. High thermal conductivity and electrical insulation properties. Ultra fine particles filler material that allows application in very thin sections. Low exotherm and great dimensional stability. Serviceable from -50°C to +150°C.