Master Bond is leading the way in semiconductor packaging with a complete line of underfill, die attach, glob top and encapsulation compounds. These systems are designed for easy processing and dependability.
Applications of Master Bond’s Semiconductor Adhesives
Our epoxy systems can be applied in many different semiconductor applications, such as:
- Passive components
- Discrete components
Properties of Master Bond Epoxy Systems for Semiconductor Applications
Select grades offer exceptional mechanical, electrical, thermal and optical properties, including:
- Thermal conductivity
- Electrical insulation
- Snap cures
- Low outgassing
- Ultra low moisture absorption
- Low coefficient of thermal expansion (CTE)
- Stress absorption
- Serviceability in extreme temperatures
Most Popular Adhesives for the Semiconductor Industry
One part, UV curable epoxy with ultra fast curing. Good physical properties and chemical resistance. Used for glob top applications. Thixotropic paste viscosity. Excellent toughness. Withstands thermal cycling. Shore D hardness 65. Serviceable from -80°F to +250°F.
Low viscosity, optically clear epoxy. Ideal for thermal cycling and bonding sensitive components. Room temperature or low elevated temperature cure. Good flexibility. Superb impact resistance. Shore D hardness 25-40. Serviceable from 4k to +250°F.
Cost effective alternative to silver filled epoxy with a silver coated nickel filler. Excellent conductivity and physical properties. Superior durability and thermal cycling capabilities. Cures readily at room temperature. Convenient one to one mix ratio weight or volume. Superb heat dissipation. Low linear shrinkage upon cure. Withstands 1,000 hours 85°C/85% RH. Serviceable from 4k to +275°F. Available in premixed and frozen syringes.
One part oven cured system (125-150°C) for potting, encapsulation and underfill applications. Good dimension stability and very easy to use. Cures rigid. Thermally conductive/electrically insulative. Excellent flow properties. Superior mechanical strength. Can be cast up to 1 inch thick. Withstands 1,000 hours 85°C/85% RH. Serviceable from -60°F to +350°F.
Flexible, low viscosity, thermally conductive silicone potting/encapsulation compound. Serviceable up to +400°F. Withstands thermal cycling. Can cure in thicknesses beyond 1-2 inches. Low exotherm. Superb electrical insulation properties.
Thermally conductive, electrically insulative epoxy. Has low thermal expansion coefficient. Superior dimensional stability. Good flow properties. Exceptionally low shrinkage upon cure. Service operating temperature range from -100°F to +250°F. Adheres well to similar and dissimilar substrates.
Silver filled system with excellent electrical conductivity and high physical strength properties. One part, heat cured (250-300°F) epoxy. Wide range of serviceability from cryogenic temperatures up to +400°F. Meets NASA low outgassing specifications. Can be applied without sagging or dripping, even on vertical surfaces. Volume resistivit <0.006 ohm-cm. Thermally conductive. Shore D hardnes >75.
Highly flexible, low viscosity, optically clear adhesive. Resistant to severe thermal cycling and thermal shock. Bonds well to dissimilar substrates. Low exotherm system. Long working life. Superior electrical insulation properties. Service temperature range from 4K to +250°F. One to one mix ratio by weight or volume.