Master Bond manufactures a range of electrically conductive adhesives, sealants and coatings to meet precise performance requirements. Our product line includes:
- Graphite Filled Electrically Conductive Adhesives
- Nickel Filled Electrically Conductive Adhesives
- Silver Coated/Nickel Filled Electrically Conductive Adhesives
- Silver Filled Electrically Conductive Adhesives
The chart below illustrates electrical conductivity values that can be achieved for select grades of systems with different fillers:
|System Type||Product||Filler||Adhesive Volume Resistivity|
|One part epoxy||EP3HTSDA-2||Silver||<0.001 ohm-cm|
|Two part epoxy||EP21TDCS-LO||Silver||<0.001 ohm-cm|
|Two part epoxy||EP79FL||Silver coated nickel||<0.005 ohm-cm|
|Two part epoxy||EP76M||Nickel||5-10 ohm-cm|
|Two part silicone||MasterSil 155||Graphite||20-40 ohm-cm|
|One part silicone||MasterSil 705S||Silver||<0.01 ohm-cm|
|Epoxy film||FL901S||Silver||<0.0002 ohm-cm|
|One part elastomer||X5G||Graphite||5-10 ohm-cm|
Chemistries of Master Bond Electrical Conductive Adhesive Systems
Master Bond’s product line of electrical conductive adhesives consists of epoxies, silicones, room temperature curing elastomers and sodium silicates. Each Master Bond grade of these formulations contains different types, shapes, sizes, volumes of highly conductive flakes, particles, spheres, granules to provide low volume resistivity for bonding, sealing, coating applications. Selecting the most appropriate chemical composition to meet your adhesive requirements is essential to obtaining the most desirable performance/processing properties. Careful consideration must be given to viscosity/reology, curing mechanism, cure speed, strength, high/low temperature serviceability, Tg, shelf life, storage etc. in addition to the level of conductivity (volume resistivity). Understanding the tradeoff in values between these different chemistries is vital to satisfying your electronic packaging and assembly needs.
Electrically Conductive Epoxies
High strength paste and film adhesives contain no solvents and are lead free. One part heat curing systems cure rapidly at moderate temperatures, require no mixing, dispense smoothly, streamline processing while avoiding waste. Special grades contain ultra small silver particle sizes, exceptionally thin bond lines, impressive thermal resistance and a volume resistivity of <0.001 ohm-cm. Two part systems offer convenient mix ratios, minimize thermal stress and are well suited to bond heat sensitive substrates. Cures for these products can be accelerated at low temperatures. Flexible and low thermal coefficient of expansion adhesives are designed to adhere well to dissimilar substrates. Fast room temperature formulations set up in 10-20 minutes. Premixed and frozen syringes are available for two component epoxies. These compounds eliminate mixing errors, alleviate waste, are bubble free and ready to use after thawing.
Electrically conductive epoxy film adhesives provide uniform bond line thickness, minimal squeeze out during bonding and superior bond strength. These B-stage formulas have extraordinary toughness, good storage stability and cure at moderate temperatures. Films can be cut into various shapes and sizes. Custom cut preforms are available for light tolerances in different configurations. Master Bond film adhesives do not require freezing.
Electrically Conductive Silicones
One component non-corrosive systems cure at ambient temperatures when exposed to atmospheric moisture. Paste viscosity materials have fast tack free speed, flexibility and high temperature resistance up to 400°F for use in bonding, gasketing, EMI/RFI shielding. Low stress compounds adhere well to a wide variety of substrates including other silicone surfaces. Addition cured two part systems have convenient one to one mix ratios, long working life, low shrinkage and cure at ambient temperatures or more quickly at elevated temperatures. They require no air for cross linking. Systems have tightly controlled viscosity and provide superior protection against exposure to moisture, vibration, thermal cycling. Products possess high elongation, guard against corrosion, have excellent tensile strength and can be easily applied with automatic dispensing equipment.
Room Temperature Curing Elastomers
Durable, resilient no mix systems have a paste like consistency and are highly effective for bonding, EMI/RFI shielding, static dissipation. They feature good peel/shear strength properties. Compositions are well suited for bonding dissimilar substrates. They perform well when exposed to thermal cycling, vibration, shock. Water and chemical resistance is outstanding. Graphite filled product is non-magnetic and has good lubricity.
Electrically Conductive Sodium Silicates
Water based system is serviceable from 0°F to 700°F. Cost effective one part system is easy to use for bonding, EMI/RFI shielding. It is highly effective as a moisture barrier. Products are applied by brush or spray to plastic housings to protect electronic devices from excessive levels of interference that effects its normal operation. Master Bond offers systems filled with silver, graphite and silver coated nickel, which provide different levels of shielding effectiveness and thermal conductivity.
Master Bond Electrically Conductive Systems
Silver conductive epoxy with low volume resistivity and USP Class VI certification. Cures at room temperature or more quickly at elevated temperatures. Durable. Serviceable from 4k to +250°F. Smooth paste. One to one mix ratio by weight or volume. Shore D hardness 50-60. High bond strength.
Silver filled electrically conductive epoxy adhesive has a rapid cure speed. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive. Smooth paste, consistency. Dispensible from syringe applicator. Serviceable from -60°F to +400°F.
Silver filled, one-part, no-mix, non-corrosive silicone system. Shore A hardness 70. Cures at room temperatures when exposed to atmospheric moisture. Extremely low volume resistivity. Most effective when applied in thin sections.
Easy to use, nickel filled elastomeric adhesive. No mix system. Good electrical conductivity. Used for shielding. Room or elevated temperature curing. Withstands thermal cycling. Serviceable from -80°F to +250°F.
Graphite filled, aqueous based, sodium silicate based coating for EMI/RFI shielding and static dissipation. Cost effective. Easily applied by brush or spraying. Superb temperature resistance from 0°F to +700°F.