Silver filled adhesive compounds

One and two component, silver filled, electrically conductive compounds feature low volume resistivity and high reliability. They offer excellent physical strength properties, superior substrate adhesion and uniform electrical conductivity. They are often used as replacements for solder.

Advanced Properties of Master Bond Silver Filled Adhesive Systems

Silver Filled, Electrically Conductive AdhesivesMaster Bond silver filled adhesives are designed to meet specific performance requirements. Certain grades offer:

  • Serviceability at high and low temperatures
  • Low stress
  • High shear and peel strength
  • Resistance to thermal cycling
  • Low outgassing
  • USP Class VI approval

Applications of Silver Filled, Electrically Conductive Systems

These products are commonly employed in the automotive, medical, appliance, electronic, electrical, microwave, aerospace and electro-optic industries. Specific applications include:

  • Die attach
  • SMD attach
  • EMI/RFI shielding
  • Grounding
  • Solder replacement
  • Flip chip attachments
  • PCB repair

Most Popular Electrically Conductive, Silver Filled Polymer Systems

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