News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	New High Strength One Part Epoxy Adhesive Cures at 80°C Release Date: 03/20/2006 Product: Supreme 3HT-80 Master Bond Supreme 3HT-80 is a new one component heat curing epoxy adhesive developed by Master Bond Inc. Supreme 3HT-80 exhibits both high shear and high peel strength. It offers superior resistance to impact, thermal shock, vibration and stress fatigue cracking. This no mix compound has an unlimited working life and cures… Read More...
	New Two Component Nickel Conductive Epoxy Adhesive Release Date: 02/08/2006 Product: EP76M Master Bond Inc. of Hackensack, New Jersey has developed a new two component, room temperature curing, nickel filled, electrically conductive epoxy adhesive called EP76M. EP76M has a convenient one to one mix ratio by weight or volume. It has a volume resistivity of 5-10 ohm-cm and excellent low outgassing properties. It has a… Read More...
	USP Class VI Approved Adhesive Resists Exposure to Repeated Sterilization Release Date: 08/01/2005 Product: EP45HT MED Master Bond Inc. of Hackensack, New Jersey has developed a new two component heat cured epoxy adhesive called EP45HT MED. This compound is durable, tough and resistant to exposure to thermal shock and many chemicals. It can withstand long term exposure form -80°F to 500°F and has a glass transition temperature of >185°C.… Read More...
	Master Bond Inc. Introduces UV19, A New Flexible, Low Viscosity UV Curable Compound Specially Designed For High Performance Laminating, Sealing, Bonding And Coating Release Date: 04/18/2005 Product: UV19 Master Bond Inc. of Hackensack, New Jersey has developed UV19, a new low viscosity, flexible UV curable composition formulated for fast, high performance laminating, sealing, bonding and casting. It is an optically clear, mobile liquid which cures readily upon exposure to UV light at ambient temperatures to a flexible strong… Read More...
	Silver Conductive Epoxy Adhesive Has Rapid Set Up Time Release Date: 02/04/2005 Product: EP77M-F Master Bond Inc. of Hackensack, New Jersey has developed EP77M-F, a new, two component, silver filled, electrically conductive epoxy adhesive for high performance bonding. This compound has a low volume resistivity of 10^-3 ohm-cm. It will set up in 5-10 minutes at room temperature, even when applied in very small… Read More...