News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.
 

Release Date:
Product: EP35AOLV

Master Bond EP35AOLV is a two part heat cured epoxy system, designed for bonding, sealing, coating and potting applications. It is a thermally conductive, electrically insulating compound that withstands aggressive chemicals, such as those found in downhole oil and gas processing. EP35AOLV exhibits superior protection against…

Release Date:
Product: EP21AC

Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required. Electrical arcing is a challenge for numerous electronic or electrical devices; this occurs when electricity jumps from one connection to another, resulting in an…

Release Date:
Product: EP4S-80

Master Bond EP4S-80 is a one component silver filled epoxy which meets NASA low outgassing requirements. It has an unlimited working life at room temperature and a moderate heat cure requirement of 80°C. With a viscosity of 10,000-15,000 cps, EP4S-80 has a smooth flow and is easily brushable, making it ideal for EMI/RFI…

Release Date:
Product: EP40TC

Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required. With a high thermal conductivity value of 8-11 BTU•in/(ft2 •hr•°F) [1.16-1.60 W/(m•K)], it is formulated with a small particle size filler…

Release Date:
Product: EP62-1HTMed

Master Bond EP62-1HTMed is a two part epoxy that meets the requirements of ISO 10993-5 for non-cytotoxicity and therefore can be utilized in many medical device applications. It features high temperature resistance, good flow properties and is suitable for bonding, sealing and coating.

“This product resists…