Two Component, High Viscosity, Room Temperature Curing Epoxy Adhesive For High Temperature Bond Applications

Master Bond Polymer Adhesive EP35TDC is a unique room temperature curing, high viscosity, two component epoxy adhesive for high temperature bonding applications. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a non critical mix ratio - (part A/part B: 100/70). Master Bond Polymer Adhesive EP35TDC produces high strength bonds whose strength is main-tained even after long exposures to temperatures in the 450-500°F range. Unlike many other epoxy adhesives its performance is relatively insensitive to mixing ratio or substrate cleaning procedure. Master Bond Polymer Adhesive EP35TDC is easily mixed and can be applied without sagging or dripping even on vertical surfaces It is 100% reactive and does not contain any diluents or solvents.

Master Bond Polymer Adhesive EP35TDC produces durable high strength and tough bonds which are remarkably resistant to thermal cycling and chemicals including water, oil and most organic solv&nts over the exceptionally wide temperature range of -60°F to 450-500°F. Adhesion to metals, glass, ceramics, wood, vulcanized rubbers and many plastics is excellent. The hardened adhesive is an electrical insulator. Color of part A black, part B amber. Master Bond Polymer Adhesive EP35TDC offers the convenience of room temperature cure with high temperature performance and is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries.