EP29LPSP: Selected as the Matrix for Developing Magnetic Interface Materials for Quantum Device Packaging
Overview of EP29LPSP
Master Bond EP29LPSP is a two-component epoxy system specially formulated for cryogenic applications and remains serviceable at temperatures as low as 4 K as an adhesive, sealant, encapsulant, and protective coating compound. It can withstand cryogenic cycling, making it suitable for use as the matrix for Mu-metal nanoparticles to fabricate magnetic interface materials that improve magnetic flux continuity and mitigate magnetic field leakage at cryogenic temperatures.
Application
Quantum devices are highly sensitive to stray magnetic fields, and even minor field leakage can reduce coherence times and degrade performance. Interfaces are particularly vulnerable, where sub-micron air voids can disrupt flux closure and lead to magnetic field leakage in quantum devices. To address this problem, a material that remains conformal at cryogenic temperatures is needed to fill these interfacial voids in magnetic shielding assemblies.
In a study selected as a Scilight by AIP Publishing to highlight its relevance to quantum applications, a team of researchers at Systems Visions, LLC and Auburn University used EP29LPSP as the matrix for Mu-metal nanoparticle fillers to develop a magnetic interface material (MIM). The high-permeability magnetic nanoparticles were embedded in cryogenically stable EP29LPSP to improve magnetic coupling across interfaces in quantum devices. The resulting composite exhibited a dramatic increase in magnetic permeability at low filler loading, consistent with a magnetic percolation-like transition. Unlike electrical percolation, this magnetic response arises from magnetostatic coupling between particles and does not require direct particle-to-particle contact while also reducing CTE mismatch and the associated thermomechanical stresses during cryogenic thermal cycling.
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Barani, Z.; Goyal, H.; Tillman, C. C.; Onwuvuche, O.; Ward, J.; Adams, M. L. Dual-functional soft magnetic interface materials for quantum packaging. Appl. Phys. Lett. 2025, 127, 211903. https://doi.org/10.1063/5.0294328
