Adhesive Systems for Smart FactoriesMaster Bond is at the forefront in developing custom adhesives, sealants, coatings, and potting compounds for assembling components that optimize the performance of smart manufacturing systems. Our cutting edge compounds are capable of improving device efficiency, connectivity, automation, agility, digitization, and safety to help realize the opportunities of Industry 4.0 initiatives. Through the integration of the Industrial Internet of Things (IIOT), AI, cloud computing, real time data processing, wired or wireless machine to machine communication, collection, storage, exchange, and analyzation of big data, manufacturers have been able to make transformative decisions to obtain better business results. Industry 4.0 technology is far-reaching and auxiliary operational benefits include:

  • Knowledge sharing
  • Identifying patterns
  • Lowering costs
  • Fewer quality issues
  • Less material and product waste
  • Better problem solving
  • Predicting downtime and maintenance requirements
  • Faster decisions
  • Gains in factory output
  • On-time delivery
  • Trimming repetitive tasks
  • Superior use of resources
  • Reduction of human errors
  • Upgrading supply chain
  • Energy conservation
  • Environmental sustainability
  • Tracking products through production
  • Adopting to market changes
  • Enhancing customer satisfaction
  • Higher revenue
  • Increased profitability
  • Accelerate innovation

Master Bond products are fastidiously blended to meet the most precise specifications. These high, medium, low viscosity compositions are easy to apply and are endowed with unique thermal, mechanical, electrical, and chemical resistance properties. They are designed to give customers a competitive edge and are noted for their reliable, consistent, and long lasting ability to perform flawlessly, even under hostile conditions. Examples of potential applications involve:

  • Mobile devices
  • PLCs
  • Sensors
  • Actuators
  • Edge devices
  • Cameras
  • Transmitters
  • Receivers
  • Adapters
  • Antennas
  • RFID technology
  • Advanced robotics
  • 3D printing
  • Cognitive computing