News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	Thermally Conductive Potting Compound Features a Low Coefficient of Thermal Expansion Release Date: 01/29/2018 Product: EP42HT-3AO Master Bond EP42HT-3AO is a two component, moderate viscosity epoxy system with good flow properties. It is ideal for small to moderate size encapsulating, potting and casting applications. It is also effective in bonding fragile components requiring a low coefficient of thermal expansion. EP42HT-3AO is designed to optimize… Read More...
	Epoxy Based, Dual Curing Adhesive Offering Thixotropic Dispensing Profile Release Date: 01/08/2018 Product: UV22DC80-10F Master Bond UV22DC80-10F is a single component, nanosilica filled compound featuring a UV and heat curing mechanism. This thixotropic, moderately low viscosity compound has a viscosity of 8,000-12,000 cps at 75°F (~23°C). It provides outstanding dimensional stability and superior physical strength properties. Additionally,… Read More...
	Heat Curable Corrosion Resistant Epoxy System Withstands Temperatures up to 500°F Release Date: 12/11/2017 Product: Supreme 34CA Master Bond Supreme 34CA is a high strength structural epoxy adhesive featuring superior resistance to aggressive chemicals such as acids, bases, solvents and oils. Serviceable from -80°F to +500°F this solvent free formulation has a working life of more than 24 hours per 100 gram batch at room temperature. It has good flow… Read More...
	Highly Flexible Addition Cured Silicone Offers Low Thermal Resistance Release Date: 11/27/2017 Product: MasterSil 151TC Master Bond MasterSil 151TC was developed to improve thermal management for electronic assemblies in bonding and gap filling applications. This 100% solids silicone compound features a thermal conductivity of 10-12 BTU•in/ft²•hr•°F [1.44-1.73 W/(m•K)] and superior electrical insulation properties. Volume resistivity i… Read More...
	Electrically Conductive Die Attach Adhesive Has Very High Thermal Conductivity Release Date: 10/30/2017 Product: EP3HTSDA-1 Master Bond EP3HTSDA-1 is a single part, no mix epoxy adhesive designed primarily for die attach applications. It exhibits a die shear strength of 20-22 kg-f and has a high thermal conductivity of over 40-45 BTU•in/ft²•hr•°F [5.7-6.5 W/(m•K)]. “This 100% solids formulation has an ideal viscosity and flow for die attach… Read More...