News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	Two Part, Low Viscosity Epoxy Offers Long Working Life and High Elongation Release Date: 04/24/2017 Product: EP29LPHE Master Bond EP29LPHE is a two component epoxy system with a low mixed viscosity of 350-700 cps. This low shrinkage/low exotherm product is particularly well suited for large volume casting applications as well as bonding, coating and sealing. “What sets EP29LPHE apart from other epoxies is that while it cures relatively rigid… Read More...
	Addition Cured Silicone is Optically Clear with Enhanced Low Temperature Serviceability Release Date: 04/10/2017 Product: MasterSil 157 Ideal for potting and encapsulation applications, MasterSil 157 is a two component silicone system that features low viscosity and low exotherm. It has superior electrical insulation properties and can cure in sections beyond 1 inch thick. MasterSil 157 is serviceable over the wide temperature range of -175°F to +500°F… Read More...
	One Part, Toughened Epoxy for Specialty Dam-and-Fill Encapsulation Release Date: 03/13/2017 Product: Supreme 3HTND-2DM Master Bond Supreme 3HTND-2DM is a rapid curing, toughened, one part epoxy system used for the dam-and-fill method for chip-on-board encapsulation. Essentially, there are two methods to protect chips and their wire bonds. One method is referred to as glob top, where the encapsulating system is dispensed and applied directly… Read More...
	Low Viscosity, Electrically Insulating Epoxy Features Excellent Optical Clarity Release Date: 02/20/2017 Product: EP30LP-2 Master Bond EP30LP-2 is a two component epoxy with a low viscosity and a volume resistivity of over 10¹⁴ ohm-cm, making it well suited for potting and encapsulation applications. This high performance system can also be used for bonding and sealing. EP30LP-2 is an easy to handle compound with a convenient… Read More...
	Room Temperature Curing Epoxy Features Low Thermal Resistance Release Date: 01/30/2017 Product: EP30TC Formulated for use in demanding thermal management applications, Master Bond EP30TC is a two component epoxy that contains a robust thermally conductive filler with very fine particle sizes. This NASA low outgassing certified system can be used for bonding, coating, sealing and encapsulating for the aerospace, electronic,… Read More...