News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	High Temperature Resistant Epoxy Has Exceptional Thermal Conductivity Release Date: 09/24/2004 Product: EP34AN Master Bond Inc. of Hackensack, New Jersey has introduced a new high performance, room temperature curing, two component epoxy adhesive/sealant called EP34AN. This compound features a thermal conductivity of 22-24 BTU/in/ft²/hr/°F. Physical properties are maintained even after long exposure to temperatures in the 400-450°F… Read More...
	New Room Temperature Curing Epoxy Resists Sterilization Release Date: 08/04/2004 Product: EP42HT-2 Master Bond Inc. of Hackensack, New Jersey has introduced a new room temperature curing, two component epoxy adhesive, sealant, coating and casting material called EP42HT-2. This compound features high temperature resistance along with outstanding chemical resistance. It is widely used in medical devices because of its ability… Read More...
	New Fast Curing Epoxy Adhesive Release Date: 06/01/2004 Product: EP24 Master Bond Inc. of Hackensack, New Jersey has developed EP24, new fast curing, two component epoxy adhesive. This high performance system cures at room temperature or more rapidly at elevated temperatures. Additionally, it will cure at colder temperatures, down to 20°F. It is easy to use and has a convenient non critical mix… Read More...
	New Epoxy Adhesive Resists High Temperatures Release Date: 03/15/2004 Product: EP35 A unique two component, room temperature curing, high temperature resistant epoxy adhesive called EP35 has been introduced by Master Bond Inc., Hackensack, N.J. This system produces high strength bonds whose strength is maintained even after long exposures to temperatures in the 450°F-500°F range. It has a 100 to 70 mix ratio… Read More...
	Thermal Conductive Adhesive has Convenient One to One Mix Ratio Release Date: 02/02/2004 Product: EP21AO Master Bond EP21AO is a two component, thermally conductive, electrically isolating epoxy adhesive with a forgiving 1 to 1 mix ratio by weight or volume. Developed by Master Bond Inc., Hackensack, N.J. this compound is extremely versatile and will adhere well to variety of similar and dissimilar substrates. It has a low… Read More...