Product Selector | MasterBond.com

Product	Certifications	Applications	Viscosity	Cure Schedule	Hardness	Temp. Range	Link to Content
EP21AOLV Two component epoxy compound for bonding, sealing, coating and potting Dielectric Constant 4.7 Tensile Lap Shear Strength 1,400-1,600 psi	RoHS Compliant	Bonding Sealing Coating Potting Encapsulation Gap Filling	Part A: 40,000-60,000 cps, Part B: 50,000-70,000 cps	overnight at 75°F followed by 3-5 hours at 150-200°F	85-95 Shore D	-60°F to +250°F	/tds/ep21aolv
EP21AOLV-1 Two component epoxy compound for bonding, sealing, coating and encapsulating Coefficient of Thermal Expansion 22-25 X 10⁻⁶ in/in/°C Dielectric Strength 450 volts/mil	RoHS Compliant	Bonding Sealing Coating Gap Filling Casting Potting	Part A: 4,000-8,000 cps, Part B: 50,000-65,000 cps	overnight at 75°F followed by 3-5 hours at 150-200°F	85-95 Shore D	-60°F to +250°F	/tds/ep21aolv-1
EP21AOLV-2LO Two component epoxy compound for bonding, sealing, coating and encapsulating Coefficient of Thermal Expansion 22-25 X 10⁻⁶ in/in/°C Dielectric Strength 400-450 volts/mil	NASA Low Outgassing RoHS Compliant 1,000 Hours at 85°C/85% RH MIL-STD-810G for Fungus Resistance	Bonding Sealing Coating Encapsulation Gap Filling	Part A: 1,500-3,000 cps, Part B: 55,000-125,000 cps	75°F: 3-4 days; 200°F: 2-3 hours; Optimum cure schedule: overnight at 75°F followed by 3-4 hours at 150-200°F	75-85 Shore D	-60°F to +250°F	/tds/ep21aolv-2lo
EP21AOLV-2Med Two component epoxy compound for bonding, coating, sealing and encapsulation Coefficient of Thermal Expansion 22-25 x 10⁻⁶ in/in/°C Dielectric Strength >400 volts/mil	ISO 10993-5 for Cytotoxicity RoHS Compliant USP Class VI Medical	Bonding Sealing Coating Encapsulation Potting Gap Filling Casting	Part A: 1,500-3,000 cps, Part B: 50,000-150,000 cps	overnight at 75°F followed by 2-4 hours at 150-200°F	>80 Shore D	-60°F to +250°F	/tds/ep21aolv-2med
EP21AOND Two component epoxy compound for high performance applications Dielectric Strength >400 volts/mil Tensile Lap Shear Strength >1,200 psi	RoHS Compliant	Bonding Sealing Gap Filling	paste	75°F: 3-4 days; 200°F: 2-3 hours; Optimum cure schedule: overnight at 75°F followed by 3-4 hours at 150-200°F	>80 Shore D	-60°F to +250°F	/tds/ep21aond
EP21AR Two part epoxy adhesive, sealant, coating and encapsulating system featuring superb acid resistance Coefficient of Thermal Expansion 40-45 in/in X 10⁻⁶/°C Dielectric Strength 440 volts/mil	RoHS Compliant	Bonding Sealing Coating Encapsulation	Part A: 10,000-15,000 cps, Part B: 4,000-6,000 cps	75°F: 24-48 hours; 200°F: 2-3 hours	80-90 Shore D	-60°F to +250°F	/tds/ep21ar
EP21ARHT Two component epoxy adhesive, sealant, coating and encapsulating system Dielectric Strength 440 volts/mil Tensile Modulus 400,000-450,000 psi	RoHS Compliant 1,000 Hours at 85°C/85% RH	Bonding Sealing Coating Encapsulation Gap Filling	Part A: 60,000-110,000 cps, Part B: 4,000-6,000 cps	75°F for 24-48 hours, 200°F for 2-3 hours	80-90 Shore D	-60°F to +400°F	/tds/ep21arht
EP21ARHTND-2 Two component epoxy adhesive, sealant and coating featuring exceptional resistance to acids Dielectric Constant 3.8 Tensile Lap Shear Strength 2,200-2,400 psi	RoHS Compliant	Bonding Sealing Coating Gap Filling	Part A: paste, Part B: paste	75°F: 24-48 hours; 200°F: 2-3 hours	75-85 Shore D	-60°F to +400°F	/tds/ep21arhtnd-2
EP21ARLV Two part epoxy adhesive, sealant, coating and encapsulating system featuring low viscosity and superior acid resistance Dielectric Constant 3.8 Dielectric Strength 440 volts/mil	RoHS Compliant	Bonding Sealing Coating Encapsulation	Part A: 3,000-6,000 cps, Part B: 4,000-6,000 cps	overnight at 75°F followed by 4 to 6 hours at 150-200°F	80-90 Shore D	-60°F to +250°F	/tds/ep21arlv
EP21BAS Two component, radiopaque epoxy system for bonding, sealing, coating and encapsulation Dielectric Strength 440 volts/mil Tensile Lap Shear Strength >1,000 psi	RoHS Compliant	Bonding Sealing Coating Gap Filling	paste	75°F: 48-72 hours; 200°F: 2-3 hours	>60 Shore D	-60°F to +250°F	/tds/ep21bas

Need Expert Guidance?

Our expert engineers offer one-on-one consultations to help you navigate our extensive material library and find the right solution for your application. We ensure confidentiality and quick turnaround (1-2 business days).

Discuss Your Application