Ideal for potting and encapsulation applications, Master Bond Supreme 121AO is a heat curing epoxy featuring excellent thermal conductivity and high temperature resistance. Scroll through this infographic to learn more.
Infographics library presents engineers with a variety of materials that cover topics ranging from product properties to industrial highlights, from "how-to" guides to innovations in adhesive technology, and more. Browse through our library for a look at what Master Bond has to offer.
Master Bond EP30LTE-2 has been developed for joining dissimilar substrates exposed to thermally or mechanically induced stresses.
Master Bond Supreme 11HT-3A epoxy features high performance properties including thermal cycling and high temperature resistance. This two part system is easy to handle with a convenient mix ratio and a long open time.
Master Bond Supreme 62-1 delivers enhanced chemical and temperature resistance while maintaining high performance properties.
Master Bond EP13LTE is a one part epoxy featuring a low coefficient of thermal expansion and high temperature resistance.
Learn about Master Bond’s nanosilica filled systems offering enhanced abrasion resistance and dimensional stability.