Two component, non-drip epoxy system for bonding, sealing and coating applications

Key Features

  • Convenient one to one mix ratio
  • Cures at ambient temperatures
  • Passes NASA low outgassing specifications
  • Paste — non-drip application
  • High bond strength
  • Dimensionally stable

Product Description

Master Bond EP21ND-LO is a two component, room temperature curing epoxy system for bonding, sealing and coating featuring outstanding physical properties. EP21NDLO has a convenient one to one mix ratio by weight. It has a paste-like viscosity after mixing. EP21ND-LO can be applied without sagging or dripping even on vertical surfaces. EP21ND-LO produces high strength, durable bonds which hold up well to thermal cycling and resist many chemicals including water, oils, fuels, acids, bases and salts. It is serviceable over the wide temperature range of -60°F to +250°F. It bonds well to a variety of substrates including metals, glass, ceramics, wood, rubber and many plastics. Once cured, EP21ND-LO is an excellent electrical insulator. The standard color of the cured material is gray. Most importantly, EP21ND- LO passes NASA low outgassing specifications as per ASTM E595. To optimize its properties, the best cure schedule for this system is 12-24 hours at room temperature, plus another 2 hours at 150-200°F. This exceptionally versatile system is widely used in the electronic, electrical, computer, metalworking, appliance, chemical, aerospace and OEM industries.

Product Advantages

  • Convenient mixing, one to one mix ratio by weight
  • Easily applied; adhesive spreads smoothly; non-drip application feature
  • High bonding strength to a wide variety of substrates
  • Excellent dimensional stability
  • Good electrical insulation properties
  • Superior durability, thermal shock and chemical resistance
  • Passes NASA low outgassing specifications
  • Lower shrinkage upon cure

Industrial Certifications

ASTM E595 Compliant





EP21ND-LO is available is various sizes and units to accommodate customer's needs.

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