EP21TDCANHT

Master Bond EP21TDCANHT is a two component, thermally conductive, electrically insulating epoxy system that can be used as an adhesive, sealant or coating. Most noteworthy is its high thermal conductivity while retaining electrical insulation properties. It a paste consistency epoxy with a forgiving one to mix ratio by weight or volume. It cures at ambient temperatures in 2-3 days or more rapidly at elevated temperatures. The optimum schedule being overnight at room temperature followed by 2-4 hours at 150-200°F. It has low shrinkage upon curing, less than 0.1%. EP21TDCANHT adheres well to many different substrates, including metals, composites, ceramics, glass, rubbers and plastics. It is a flexibilized system that is well suited for bonding dissimilar substrates. Also, it withstands rigorous thermal cycling as well as thermal and mechanical shock. EP21TDCANHT has a low coefficient of thermal expansion, exceptional dimensional stability and very high compressive strength. Its service temperature range is -100°F to +250°F. The color of Parts A and B is gray. EP21TDCANHT can be used in electronic, aerospace and specialty OEM applications, where a toughened, high strength, higher thermal conductivity along with being electrically insulating epoxy is needed.

Product Advantages

• Convenient mixing and handling
• Versatile cure schedules
• High bonding strength to a wide variety of substrates
• Toughened system, compatible for bonding dissimilar materials
• Higher thermal conductivity; retains good electrical insulation
• Very low shrinkage and high dimensional stability