EP28M-1

Master Bond Polymer System EP28M-1 is a remarkably high performance room temperature curing low viscosity, two component epoxy compound formulated for high performance casting and bonding. It is 100% reactive and does not contain any diluents, solvents or other volatiles. Master Bond Polymer System EP28M-1 is readily prepared for use by mixing the two components with a convenient two (2 ) to one (1) mix ratio by weight. Cure is quite easy even at low temperatures and high relative humidities. It can be readily accelerated by heating to moderately elevated temperatures to complete curing. The ready cure characteristics coupled with unique resistance to blushing and exudation, high toughness and superior wear resistance make EP28M-1 particularly attractive for applications where new castings must be put into service within a matter of hours and then perform well over long periods of service.

Master Bond Polymer System EP28M-1 has proven ideally suited for industrial as well as institutional and commercial casting and bonding applications particularly in applications requiring durability, chemical resistance, easy, low cost maintenance and a high degree of dimensional stability. It is highly recommended for casting and bonding in the electronic, electrical, electro-mechanical, computer, optical and related industries.