EP30-1LP

Two component epoxy system for high performance bonding, coating, sealing and casting
Key Features
  • Very low viscosity
  • Outstanding optical clarity
  • Exceptional physical strength
  • Electrically insulative
  • Dimensionally stable
  • Resistant to a wide variety of chemicals
Typical Properties
Viscosity
Part A: 200-600 cps, Part B: 280-500 cps
Cure Schedule
75°F: 24-48 hours; 200°F: 2-3 hours
Hardness
>75 Shore D
Service Temperature Range
-60°F to +250°F
Dielectric Constant
60 Hz: 3.55; 1 KHz: 3.35
Dielectric Strength
>440 volts/mil
Dissipation Factor
60 Hz: 0.005; 1 KHz: 0.006
Linear Shrinkage
less than 0.001 in./in.
Refractive Index
1.57
Volume Resistivity
>10¹⁵ ohm-cm
EP30-1LP Two Part Epoxy System
Discuss with a Specialist
(1-2 Business Day Request) Get Technical Data sheet
(Instant Email Delivery) Request Safety Data sheet
(1-2 Business Day Request)
Applications

Bonding

bonding

Sealing

sealing

Coating

Coating

Encapsulation

encapsulation

Potting

potting
Certifications

Meets EU Directive 2015/863

Packaging

Cans

Pails

Premixed & Frozen Syringe

Product Description

Master Bond EP30-1LP is an ultra low viscosity, two component epoxy system for high performance bonding, coating, sealing, potting and encapsulation. It readily cures at room temperature or more rapidly at elevated temperatures, and has a five to one mix ratio by weight. This adhesive is 100% reactive and does not contain any solvents or diluents. EP30-1LP has outstanding physical strength properties along with excellent electrical insulation characteristics. This highly dimensionally stable system has very low shrinkage after cure, less than 0.001 in./in. EP30-1LP possesses very good optical clarity along with superior light transmission when compared to many other epoxies. This system bonds well to a variety of substrates including metals, glass, and ceramics, as well as many plastics and rubber materials. EP30-1LP forms high strength, rigid bonds that resist chemicals including water, oil, acids, bases and many solvents. Its low viscosity enables this system to be used for special gap filling applications where space is limited. Master Bond Polymer System EP30-1LP is widely used in electronic, electrical, optical, chemical and related industries.

Product Advantages

  • Convenient mixing: easy to use mix ratio—five to one by weight
  • Easy application: only contact pressure required while curing; adhesive spreads readily
  • Versatile cure schedules: ambient temperature cures or faster at higher temperatures
  • Superb ability to fill smaller gaps
  • High bond strength to a wide variety of substrates
Discuss with a Specialist
(1-2 Business Day Request) Get Technical Data sheet
(Instant Email Delivery) Request Safety Data sheet
(1-2 Business Day Request)
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How to order

Verify Your Product Selection

With thousands of custom formulations available, our expert engineers provide personalized consultation to ensure you select the ideal adhesive. We will follow up with a product and packaging recommendation for your specific application.

Get a Quote

Our customer service team will follow up with a detailed quote with packaging and shipping options.

Place Your Order

We'll work with your company to process the order efficiently.

Receive Your Material

Your adhesive will be made to order and shipped to you. Typical lead times are 10-14 business days, with rush options available for urgent orders.

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