EP30ANHT

Master Bond EP30ANHT is a two component epoxy for high performance bonding, sealing, coating and potting featuring reliable thermal conductivity while retaining electrical insulation. It has an easy to use mix ratio of 100 to 10 by weight. It is a low to moderate viscosity system with excellent flow properties. It will cure in 2-3 days at ambient temperatures or 2-3 hours at 150-200°F. To optimize properties, the recommended cure schedule is overnight at room temperature followed by 2-4 hours at 150-200°F. EP30ANHT has exceptionally low shrinkage upon curing and a high degree of dimensional stability.

This system bonds well to a wide variety of substrates including metals, composites, ceramics, and many plastics. Upon curing, it forms a high strength, rigid matrix that transfers heat without conducting electricity. Its moderate viscosity allows it to be used for bonding as well as sealing and potting. The presence of the aluminum nitride filler gives the system a low coefficient of thermal expansion (CTE) as well as enhanced abrasion resistance. The system has reasonably good chemical resistance to fuels, oils, acids, bases and cleaning agents. The service temperature range is -60°F to +450°F. The color of Part A is gray and Part B is clear. EP30ANHT can be used in applications in aerospace, electronics, optical and specialty OEM where a thermally conductive, electrically insulative adhesive or sealant is needed.

Product Advantages

• Good flow properties after mixing
• Can be cured in castings up to 1” thick
• Conducts heat but not electricity
• Highly abrasion resistant
• Low coefficient of thermal expansion