One component, B-stage epoxy for potting, encapsulation, coating and bonding

Key Features

  • Toughened system
  • Excellent thermal conductivity
  • Superior electrical insulation properties
  • Resists up to +500°F
  • One part, B-stage system
  • Available in 30 gram cookies

Product Description

Master Bond EP36AN is a unique one component, high performance epoxy for bonding, encapsulation, potting and coating featuring thermal conductivity, electrical insulation and high temperature resistance. It differs greatly from other heat resistant epoxies as it has far more toughness and flexibility. Its forgiving nature at high temperatures imparts vastly superior thermal and mechanical shock resistance as well as superb thermal cycling ability when compared to more standard high temperature resistant epoxies. EP36AN bonds well to a variety of substrates including metals, glass and many plastics. It has good chemical resistance to water, acids, bases, fuels and oils. This one component system is primarily used for potting but can also be used for bonding and sealing. The service temperature range is -100°F to +500°F. Master Bond EP36AN offers the additional convenience of being a one component system together with flexible cure schedules. Also, the thermal conductivity of EP36AN is exceptionally high—over 3 W/m-k.

EP36AN has a unique chemistry which allows the product to be both tough and heat resistant without sacrificing mechanical, electrical, or thermal properties. For example at 100°C, EP36AN has a Shore D hardness of 25-30 and yet maintains its integrity and dimensional stability. This lower hardness is indicative of its toughness and flexibility and translates into its enhanced ability to withstand rigorous thermal cycling. These properties— mechanical, thermal and electrical—are sustainable up to +500°F, and as a consequence, EP36AN is particularly well suited for potting and encapsulation applications where thermal conductivity, electrical isolation and the ability to withstand severe thermal cycling over a wide temperature range are needed.

While EP36AN is an unconventional epoxy, it is conveniently available in 30 gram cookies as well as pints and quarts. This system is formulated at elevated temperatures and poured into cans or 30 gram cookie molds and solidifies. Since it is a solid; it must be heated in a forced air or convection oven at 200°F for about 30 minutes to transform it to a liquid. The working life at this temperature is 60-75 minutes. To complete the cure, the temperature should be 350°F for 2-3 hours. When liquefied, it is easy to apply as an encapsulant or an adhesive. Liquefied but uncured material can be reused by allowing EP36AN to resolidify at room temperature. Cured material cannot reliquefy; resolidified materials can become liquid again. This epoxy is amber in color. EP36AN is a specialty system that is primarily used in electronic and aerospace applications.

Product Advantages

  • One component system
  • Thermally conductive, electrically insulative
  • Combines flexibility and temperature resistance
  • Ideal for potting and encapsulation
  • Available in conveniently prepared 30 gram cookies
  • Capable of withstanding rigorous thermal cycling and thermal shocks
  • Passes fungus resistance MIL-STD-810G

Industrial Certifications

MIL-STD-810G for Fungus Resistance



EP36AN is available is various sizes and units to accommodate customer's needs.

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