EP52TC

Master Bond EP52TC is a thermally conductive, electrically insulating two part epoxy that combines good physical properties and the ability to transfer heat rapidly and effectively. It uses relatively small thermally conductive particles ranging in size from 5 to 30 microns. Typically, thermally conductive epoxies cannot be applied in thin sections. However, the combination of a high thermal conductivity filler, and thin bond lines, enables the low thermal resistance. Thermal resistance is calculated from the formula R=t/K (where “R” is the thermal resistance, “t”, the thickness and “K” the thermal conductivity of the material). Thermally conductive epoxy usually has a thermal resistance ranging from 30-45 x 10-6 K•m2/W. With EP52TC, the thermal resistance is significantly lower, 10-15 x 10-6 K•m2/W, because of the high conductivity filler and the ultra small particle size. The end result is the epoxy is very effective in transferring heat. The lower the thermal resistance, the better it is for heat transfer properties.

EP52TC has a forgiving 100 to 40 mix ratio by weight. The working life ranges from 90-120 minutes depending upon the amount of material that is mixed. This epoxy typically cures in 4-7 days or in 4-6 hours at 150-200°F. The optimum cure is overnight at room temperature followed by 3-5 hours at 150-200°F.

The system bonds well to a wide variety of substrates, including metals, composites, glass, ceramics and many plastics. Other attributes include a very low coefficient of thermal expansion, low shrinkage upon curing and exceptional dimensional stability. EP52TC has first rate electrical insulation properties. It resists water, fuels, oils and a number of acids and bases. It is serviceable from -100°F to +300°F. The color of Parts A and B is gray. This very special system can be used in applications in the aerospace, electronic, optical, specialty OEM and many other high technology industries, where optimum thermal transfer properties are a necessity.

Product Advantages

• High thermal conductivity and electrical insulation values
• Exceptionally low coefficient of thermal expansion
• Very low thermal resistance
• Good physical strength properties