Two component epoxy system for bonding, sealing, coating and potting featuring a natural curing agent
- Low viscosity
- Long working life
- Good chemical resistance
- Superior wetting properties
Master Bond EP70CN is a low viscosity epoxy for high performance bonding, sealing, coating and potting. The mix ratio is a forgiving 100 to 30 by weight along with a desirably long open time. It cures readily at ambient temperatures and more rapidly at elevated temperatures. An optimum curing schedule is overnight at room temperature followed by 3-4 hours at 140-170°F. EP70CN does not contain any solvents or diluents. Also, the system has low shrinkage upon curing.
It is an excellent adhesive and bonds well to a wide variety of substrates including metals, ceramics and many rubbers, plastic materials, and especially composites. Additionally, it wets out very nicely and fits well for applications involving bonding and sealing fibers. Other desirable properties include exceptional physical strength and very good chemical resistance.
As one might expect, it is a robust electrical insulator which combined with its lower exotherm enables it to be used in a wide array of potting applications. The service temperature range is -80°F to +450°F. The color of Part A is clear and Part B is light orange. This versatile system can be used in aerospace, electronic, opto-electronic and specialty type OEM applications, particularly those involving composites and fibers.
- Low viscosity and longer open time
- Very fine wetting properties
- First rate temperature and chemical resistance
- Splendid physical strength properties
- Good optical clarity and light transmission
- NASA low outgassing
EP70CN is available is various sizes and units to accommodate customer's needs.