B-staged film for high performance bonding and sealing
- High temperature resistant
- Thermally conductive
- Tough and flexible
- Easy to apply and doesn’t require freezing
- Excellent electrical insulation properties
- Uniform bond line thickness
Master Bond FLM36 is a very special film adhesive featuring incomparable strength properties, high temperature resistance and first class thermal conductivity and electrical insulation properties. Based on the Master Bond EP36AO formulation, this film differs from other heat resistant epoxies for it possesses far more toughness and flexibility than conventional high temperature resistant epoxies. Although it has a lower glass transition temperature and is softer above it, FLM36 retains its very high physical strength properties profile up to 500°F. FLM36 combines markedly enhanced thermal and mechanical shock resistance and thermal cycling capabilities. FLM36 bonds well to a variety of substrates including metals, composites, glass and many plastics. It has good chemical resistance to water, acids, bases, fuels and oils. The service temperature range is -100°F to +500°F. Being a film, it, of course, doesn’t require any mixing. The processing is very straightforward, that is heat curing at 350°F for 1-2 hours in order to obtain optimal properties. Two outstanding features of films include their uniformity of bond line thicknesses and limited squeeze out during bonding.
This product is offered in three standard sizes: FLM36-4A is 4 x 4 x 0.008 inches, FLM36-8B is 8 x 8 x 0.008 inches and FLM36-12C is 12 x 12 x 0.006 inches. The film can be cut with a pair of sharp scissors into various shapes and sizes. With intricate shapes, preforms can be provided; although, a technical drawing with tolerances would be required. The films are rugged, durable and not prone to cracking. Using the film is simple. The films have release paper on each side. After the substrates are surface prepared, the release paper is removed on one side to expose the adhesive. It’s carefully placed onto the part and pressure is applied. The film is adhering to the surface as it possesses a “tackiness” to it. The second release lining is removed and the other substrate is affixed accordingly. The assembly is lightly fixtured and cured for 1-2 hours at 350°F. The bonded parts should be returned to 75°F before removing the fixtures.
The film is black in color to provide a vivid contrast from the release papers. Unlike nearly all the thermoset films of this type, FLM36 does not require freezing or refrigeration. The cornucopia of advantages in using this film with its unique flexibilized epoxy chemistry is that it offers high temperature resistance, extraordinary toughness and flexibility and the ability to withstand rigorous thermal cycling. These properties enable it to be an excellent candidate for aerospace, electronic, opto-electronic and specialty OEM applications. Also, its thermal conductivity and electrical insulation properties are integral constituents of the product property profile of FLM36.
- Provides uniform bond line thicknesses, virtually no squeeze out when curing
- Exceptionally rugged; easily cut into shapes
- Black color facilitates application; cures readily at 350°F for 1-2 hours
- After polymerization it combines high temperature resistance with flexibility and toughness
- Fantastic bond strength
FLM36 is available is various sizes and units to accommodate customer's needs.