Two component, addition curing silicone for potting, encapsulation and sealing
- Optically clear
- Electrically insulative
- Low viscosity
- Serviceable from -65°F to +400°F
- Cures at room or elevated temperatures
- Withstands 1,000 hours 85°C/85% RH
Master Bond MasterSil 151 is a two component, low viscosity silicone compound for high performance potting and encapsulation. It is an addition cured system and does not require exposure to air for complete cross-linking. It has a ten to one mix ratio by weight and will not outgas while curing. The system is 100% solids and contains no solvents. MasterSil 151 has a thin consistency with excellent flow making it highly desirable for potting and encapsulation. This silicone combines remarkable flexibility, high temperature resistance, superb electrical insulation along with outstanding optical clarity. It is capable of withstanding the most rigorous thermal cycling and shock. Its water resistance is quite good. These properties enable MasterSil 151 to be used in applications involving sensitive optical and electrical components. Some other specialty uses include encapsulating LEDs, optical fiber cladding and potting connectors. Also noteworthy are its low index of refraction and its ability to transmit light very well from 220-2,500 nanometers. The service temperature range for this system is -65°F to +400°F. MasterSil 151 has prominence in optical, opto-electronic, specialty OEM and related applications where the attributes mentioned above are desirable.
- Addition cured, no by-products released while curing
- Does not require air or moisture for curing
- Long pot life
- Low viscosity, ideal for potting and encapsulation
- Optically clear with lower index of refraction
- Superior electrical insulation properties, highly resistant to water
MasterSil 151 is available is various sizes and units to accommodate customer's needs.