Two Component, Room Temperature Curing, Thermally Conductive, Electrically Isolating Epoxy For Bonding & Sealing Featuring High Shear & Peel Strength

Master Bond Polymer System Supreme 11AO is a two component epoxy resin system for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures with a convenient one-to-one (1:1) mix ratio by weight or volume. Its most outstanding features include high thermal conductivity, excellent electrical insulation properties, temperature resistance up to 250°F as well as superior bond strength. Supreme 11AO is a paste that can be applied without sagging or dripping even on vertical surfaces. As a toughened system, it is well suited to applications involving thermal cycling. Its chemical resistance profile includes water, oils and most organic solvents. It has excellent adhesion to most metals, ceramics, glass and vulcanized rubbers as well as many plastics. Supreme 11AO is also unique in that the bond strength is high in both shear and peel modes. Both part A and B are colored off-white. Master Bond Supreme 11AO is widely used in the electronic, electrical, computer, metalworking, appliance, automotive and chemical industries where high bond strength and superior heat transfer properties are required.