Toughened, high strength, two component epoxy for bonding and sealing
- Convenient handling
- Thermally conductive & electrically insulative
- Exceptionally high physical strength profile
- Meets ISO 10993-5
Master Bond Supreme 11AOHTMed is a two part, room temperature curing epoxy for bonding and sealing. It is a faster curing system with a paste consistency and a forgiving 1 to 1 mix ratio by weight. It is formulated to cure readily at ambient temperatures or more rapidly at elevated temperatures. The optimum curing schedule is overnight at room temperature followed by 2-3 hours at 120°F to 150°F. The epoxy is 100% reactive and contains no solvents or diluents. It has low shrinkage and high dimensional stability.
The system bonds well to a wide variety of substrates including most metals, ceramics, and glass as well as many rubbers and plastics. Supreme 11AOHTMed is well suited for bonding dissimilar substrates. and is a toughened system that withstands rigorous thermal cycling. While it is thermally conductive, it is still a dependable electrical insulator. Supreme 11AOHTMed is resistant to many sterilants including EtO, gamma, radiation, glutaraldehyde and hydrogen peroxide, among others. The color of Part A is gray and the color of Part B is off-white. Supreme 11AOHTMed is a good candidate for applications where high strength bonding in medical device manufacturing is critical. Its thermal conductivity also can be desirable in certain situations. However, what makes this system so special is its super high strength profile.
- One to one mix ratio, fast setting
- Versatile cure schedules
- High physical strength properties, especially lap shear
- Can withstand rigorous thermal cycling
- Passes ISO 10993-5
Supreme 11AOHTMed is available is various sizes and units to accommodate customer's needs.