Technologically innovative epoxy compounds have been developed to enable mechanical/electronic devices to operate reliably upon exposure to hostile environmental downhole conditions. These special high pressure, high temperature (HPHT) products face formidable challenges and are often deployed in remote unexplored regions including subsea reservoirs. Job proven application specific formulations provide economically viable solutions that maximize efficiency/productivity while emphasizing all safety considerations.
Master Bond High Pressure, High Temperature (HPHT) Epoxy Adhesives, Sealants, Potting Compounds
Master Bond's team of technical specialists will work with oilfield equipment engineers to select the proper HPHT compound to help design downhole component hardware for extended lifetime service. Important considerations include static/dynamic loads, internal/external pressures, service operating temperatures, resiliency to repeated thermal expansion/contraction and corrosion/erosion. Component/subsystem/system accelerated evaluation testing is essential for validation of functional specifications to anticipated downhole conditions. Improved formulations exhibit superior resistance to corrosive fluids and gases. Master Bond is also currently pushing the limits of polymer compositions for ultra HPHT projects.
Most Popular High Pressure, High Temperature Epoxy Adhesives, Sealants, Potting Compounds
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Supreme 45HTQ Two component, toughened, quartz filled epoxy with exceptional abrasion resistance. Heat curing system. Long working life after mixing. High compressive strength. Superb dimensional stability. Serviceable from -60°F to +450°F. Withstands exposure to petrochemicals acids, bases, solvents. Good strength retention at elevated temperatures. Successfully tested for 1,000 at 85°C/85% RH. |
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EP42HT-2AO Thermally conductive, electrically insulative. Ideal for potting and encapsulation. Castable up to 3-4 inches. Excellent chemical resistance. Enhanced thermal cycling capabilities. Good flow. Serviceable from -100°F to +400°F. Impervious to intermittent exposures to steam. Shore D hardnes >80. |
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EP112AO Low viscosity potting, casting, encapsulation compound. Two component, solvent free, heat cure epoxy. Moderate viscosity. Good water and chemical resistance. Excellent thermal conductivity and electrical insulation properties. Long working life. Viscosity 50-200 cps. Service temperature range from -60°F to 500°F. |
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Supreme 12AOHT-LO One component, heat cure system for bonding, sealing. High strength product. Service operating temperature range from 4K to +500°F (260°C). Resists aggressive thermal cycling and shock. Substantial thermal conductivity of 9-10 BTU in/ft2 hr °F. Smooth thixotropic paste. NASA low outgassing approved. Meets MIL-STD-883J Section 3.5.2 for thermal stability. Withstands 1,000 hours 85°C/85% RH. |
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EP125 Structural epoxy adhesive resists temperatures up to 500°F. Exceptional durability and flexural strength. High adhesion to metallic and non-metallic substrates. Heat curable system. Tg +240°C. Special two part epoxy with very long working life. Excellent compressive strength. Service operating temperature range from -80°F to +600°F. |
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EP17TF One part, heat cured epoxy system. Heat resistant to +550°F. High compressive and tensile shear strength. Excellent toughness and resistance to thermal cycling, shock and vibration. Paste consistency. |
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Supreme 46HTQ Quartz filled epoxy system for bonding, sealing, casting. Service temperature range -80°F to +500°F. Superior chemical and abrasion resistance. Dimensional stability. High compressive strength. Good strength retention at elevated temperatures. Oven curing compound. |
