News Releases

Stay informed about Master Bond's latest product developments, company events, and other exciting announcements.

	One Part High Strength Epoxy With High Thermal Conductivity Meets NASA Low Outgassing Specifications Release Date: 06/08/2010 Product: Supreme 10AOHT-LO Resistance to impact, thermal shock, vibration and stress fatigue cracking is of vital importance in the aerospace, optical, medical and oil/chemical processing industries. Master Bond Polymer Adhesive Supreme 10AOHT-LO is a single component, no mix, thermally conductive compound featuring superior electrical insulation and… Read More...
	Single Component Snap Cure Epoxy Has Outstanding Electrical Properties and Chemical Resistance Release Date: 05/06/2010 Product: EP17HT-3 Master Bond EP17HT-3 is a one part epoxy that sets up in 20 to 30 seconds and snap cures in only 2 to 3 minutes at 250°F-300ºF. As a one part system, no mixing is required and the epoxy can be cured in sections up to 1/4" thick. Moreover, its working life is indefinite as it will not gel until heated above 200ºF. With a… Read More...
	Heat Resistant Epoxy Adhesive for High Performance Structural Bonding Release Date: 04/08/2010 Product: Supreme 46HT-2 For outstanding, high performance bonding strength to both similar and dissimilar substrates, Master Bond Polymer Supreme 46HT-2 was developed. This two component adhesive features high temperature resistance along with superior toughness and strength. It has excellent durability, thermal cycling and shock capabilities, as well… Read More...
	UV Curable Adhesive/Sealant Meets NASA Low Outgassing Requirements Release Date: 03/18/2010 Product: UV10TKLO-2 Master Bond Inc., Hackensack, NJ, is pleased to announce the development of a unique one component UV curable modified epoxy system called UV10TKLO-2. This formulation offers optical clarity, high physical strength properties, and has outstanding chemical resistance. It is not oxygen inhibited and cures rapidly at room… Read More...
	Low to Moderate Viscosity, Toughened Two Component Epoxy System for High Performance Casting, Bonding and Sealing Release Date: 02/25/2010 Product: EP21FL Master Bond EP21FL is a two part epoxy resin system that features low to moderate viscosity. It is well suited for potting, coating and sealing electronic assemblies and excels at bonding dissimilar substrates with different coefficients of expansion. This high performance adhesive has a wide service temperature range of -60ºF to… Read More...