High performance, two component, heat curing epoxy for potting & encapsulation
- Excellent toughness
- Outstanding temperature resistance
- Exquisite thermal conductivity
- First class dimensional stability
Master Bond EP112FLAN-1 is a toughened two component, high performance epoxy resin system featuring very good temperature resistance, extraordinarily high thermal conductivity, fine electrical insulation values and sound dimensional stability. The mix ratio is 100:80 by weight. After mixing EP112FLAN-1 has a very long open time of a few days but requires oven curing. A typical cure schedule is 2-3 hours at 250°F followed by 5-8 hours at 300°F with a 2 hour post cure at 350°F, although, a number of variations are possible. Also EP112FLAN-1 is ideal for potting and encapsulation because of its lower viscosity and its advantageous flow properties. The epoxy bonds well to metals, composites, glass, ceramics and many plastics. As mentioned previously, its most prominent features include toughness, solid thermal conductivity, superior electrical insulation properties and ample dimensional stability. The service temperature range is -60°F to +500°F. Another noteworthy property is its toughness which allows it to be utilized in applications where thermal cycling is an important consideration. EP112FLAN-1 has very low exotherm upon curing and is suitable for larger sized castings and potting applications. EP112FLAN-1 is a specialty type product formulated for challenging electrical, electronic applications where high temperature resistance, a degree of toughness and solid electrical insulation along with superlative thermal conductivity is desirable.
EP112FLAN-1 is available is various sizes and units to accommodate customer's needs.