These high performance systems for bonding, sealing, coating and encapsulation represent new innovative formulations that have recently been added to our product line.

One Component “Snap Cure” Epoxy Adhesive

Master Bond EP3SP5FLFeaturing an extraordinary combination of properties, EP3SP5FL is a one component epoxy offering snap cures of 1-2 minutes at 300°F. It has high strength properties, superior electrically insulation and is readily reworkable. Additionally, it can withstand exposure to thermal cycling.

  Request a technical data sheet for EP3SP5FL

Condensation Curing Silicone Is Optically Clear

MasterSil 152 Low viscosity MasterSil 152 is a two component silicone system that cures when exposed to air at room temperature. It has an exceptionally low viscosity and outstanding electrical insulation properties, making it ideal for potting and encapsulation applications.

  Request a technical data sheet for MasterSil 152

High Temperature Resistant Coating System

Master Bond MB600G Ideal for electromagnetic interference and radio frequency interference shielding applications, MB600G is an aqueous based, sodium silicate system with a graphite filler. Graphite filled materials are widely used for shielding and static dissipation applications because of their balance of shielding effectiveness and cost. MB600G is serviceable over the remarkably wide temperature range of 0°F to +700°F.

  Request a technical data sheet for MB600G

Ideal for Impregnation Applications

Master Bond EP112LS Master Bond EP112LS is optically clear, features reliable non-yellowing properties and has a refractive index of 1.55. This electrically insulative system is resistant to chemicals including water, oils, fuels, acids and bases. Featuring a mixed viscosity of 50-200 cps, EP112LS is serviceable over the temperature range of -60°F to +450°F.

  Request a technical data sheet for EP112LS
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