Master Bond Inc., Hackensack, N.J. has introduced Supreme 11AOHT, a two component room temperature curing epoxy adhesive with high thermal conductivity and excellent electrical insulation properties. Supreme 11AOHT is a paste that can be applied without sagging or dripping even on vertical surfaces. It has a convenient mixing ratio of 1 to 1 by weight or volume.
A new one component, low viscosity, optically clear, UV curable adhesive called UV10MED has been developed by Master Bond Inc., Hackensack, N.J. This compound is USP Class VI approved and is recommended for use in medical device manufacturing. It offers superior adhesion to metals, glass, ceramics and most plastics.
Master Bond Inc., Hackensack, N.J. has introduced a new two component epoxy adhesive/sealant for cryogenic applications. Called EP29LPSP, this compound is able to withstand temperatures as low as 4K. Additionally, it is able to resist cryogenic shocks (i.e. room temperature down to liquid helium temperatures in a 5-10 minute time period).
Master Bond Inc., Hackensack, N.J. has introduced a new one component, optically clear, non-yellowing UV and/or heat curable polymer system called UV15-7DC. This high performance system is designed for bonding, sealing and coating applications. It is 100% reactive and does not contain any solvents or other volatiles.
A new flexible, tough epoxy potting and encapsulation compound called EP30FL has been introduced by Master Bond Inc., Hackensack, NJ. Master Bond EP30FL has extraordinarily low viscosity and is easy to apply. It can be used in both thick and thin cross sections. This compound is 100% reactive and does not contain any volatiles.
Master Bond EP21TDCSFL is a new two component, room temperature curing, silver filled, epoxy adhesive developed by Master Bond Inc., Hackensack, N.J. It exhibits high flexibility and has an elongation of >60%. EP21TDCSFL is easy to use and has a 1 to 1 mix ratio by weight or volume. It cures at room temperatures or more rapidly at elevated temperatures.