Die shear testing is vital to assess the reliability of the adhesive for surface mount and die attach applications. At Master Bond, our adhesives are analyzed by an independent lab for die shear strength. Testing is based on Mil-Std-883 Method 2019. The main objective of die shear testing is to evaluate the adhesive strength between a semiconductor die and the substrate of the package. In this test the force is applied in a perpendicular direction to the die edge, and parallel to the die attach or substrate plane.
The compounds we used for testing are one component electrically conductive as well as non-conductive epoxy systems that have been designed for die attach applications and require heat for curing: Supreme 3HTND-2DA, EP3HTS-TC, EP3HTSDA-2, EP17HTDA-1, and EP17HTDA-2. Using a die size of roughly 2 x 2 mm (80 x 80 mil), the adhesives were applied and cured in accordance with their specifications. Results of the die shear test are indicated in the chart below.
Die Shear Strength Testing Results
Disclaimer: The findings in this article are not meant to be used for specification purposes.
Adhesives Featuring High Die Shear Strength
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Supreme 3HTND-2DA One component, fast curing die attach adhesive. Excellent die shear strength. Serviceable from -100°F to +400°F. Low ionics. Superior thermal conductivity and electrical insulation properties. Dispenses smoothly without tailing or bleed out. Cures in 5-10 minutes at 150°C. NASA low outgassing approved. Available in syringes. Well suited for automatic dispensing. Performed well in 85°C/85% RH testing. |
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EP3HTS-TC Silver filled electrically conductive, for die attach and general bonding. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive. Thixotropic paste, consistency. Available in syringes that are compatible with various types of automatic dispensers or manual dispensing. Serviceable from -80°F to +400°F. |
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EP3HTSDA-2 Silver filled electrically conductive epoxy has a rapid cure speed. Low volume resistivity and high temperature resistance. Superior bond strength. Thermally conductive with incredibly low thermal resistance. Smooth paste, consistency. Available in syringes that are compatible with various types of automatic dispensers or manual dispensing. Serviceable from -80°F to +450°F. |
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EP17HTDA-1 Single component heat curable epoxy adhesive/sealant. Non-drip system. Resists up to 525°F. Meets NASA low outgassing specifications. Meets MIL-STD-883J Section 3.5.2 for thermal stability. High lap shear, tensile and compressive strength. Tg of 230-240°C after post cure. |
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EP17HTDA-2 One component, heat cured epoxy for bonding and sealing, as well as die attach applications. Flowable, high viscosity system, cures in 4-5 hours at 300°F or 3-4 hours at 350°F. Post cure to optimize properties. High glass transition temperature. NASA low outgassing approved. |
