One component die attach epoxy system with exceptionally high glass transition temperature
- Not premixed and frozen
- Paste consistency
- Thermally conductive, electrically insulating
- High compressive strength
Master Bond EP17HTDA-2 is a one component, heat cured epoxy system for bonding, sealing, and die attach applications. It does not require any mixing and the curing temperature is 300-350°F. It is not premixed and frozen and has an unlimited working life at room temperature. It will cure in either 4-5 hours at 300°F or 3-4 hours at 350°F. To optimize properties, use one of the above cure schedules plus an additional 2-3 hours at 400°F. Its viscosity and flow allow it be an effective adhesive for die attach applications.
EP17HTDA-2 bonds well to a wide variety of substrates such as metal, ceramics, plastics and composites. It has an impressive array of physical strength properties, particularly tensile modulus, compressive strength and glass transition temperature. The system is thermally conductive and electrically insulative. It is highly chemically resistant to water, acids, bases, solvents, fuels, and oils. It has superb electrical insulation along with good thermal conductivity. The service temperature range is from -80°F to +600°F. The standard color is off white. EP17HTDA-2 is recommended for specialty type applications where its exceptionally high Tg of 185-190°C is a critical factor in die attach applications.
- Single component system
- Thermally conductive, electrically insulative
- Can withstand temperatures used in electronic packaging such as wire bonding
- DIspenses well for die attach applications
- NASA low outgassing
EP17HTDA-2 is available is various sizes and units to accommodate customer's needs.