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LATEST PRODUCT

Underfill Epoxy Offers Thermal Conductivity and Electrical Insulation

Master Bond EP29LPTCHT is a two component, low viscosity epoxy compound that can be effectively...

Read more

TECH TIPS

  • Comparison of Acetoxy Curing and Neutral Curing Silicones
  • Internet of Things (IoT)
  • Potting and Sealing Electronic Components
  • Modulus, Poisson’s Ratio and Elongation
  • All About Addition Curing Silicones

LATEST WHITE PAPER

Understanding Low Outgassing Adhesives

Engineers often want to know whether an adhesive is low outgassing or generic. And while there are cases when nothing but...

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INDUSTRIAL CERTIFICATIONS

  • USP Class VI for biocompatibility
  • ISO 10993-5 for cytotoxicity
  • NASA low outgassing
  • FDA CFR 175.300 & 175.105
  • MIL-STD-810G for fungus resistance
  • MIL-STD-883J for thermal stability
  • FAR 25.853(a) for flame retardancy
  • UL 94V-0 & UL 94V-1
  • UL 1203 for explosion-proof
  • 85°C/85% RH
  • See all certifications
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