Master Bond Product Search

543 products match

EP21AOLV-2Med Two Part Epoxy Adhesive EP21AOLV-2Med

Meets USP Class VI requirements and passes ISO 10993-5 tests for cytotoxicity. Smooth flowable consistency. Thermally conductive//electrically insulative. Can be used for bonding, sealing, coating, encapsulation. One to one mix ratio. Cures at room temperature. Resists EtO, radiation, and chemical sterilants. Serviceable from -60°F to +250°F.

EP21AOND Two Part Epoxy System EP21AOND

Two component non-drip epoxy adhesive. Thermal conductive/electrically insulative. Versatile cure schedules. High bond strength to similar and dissimilar substrates. Serviceable from -60°F to +250°F.

EP21AR Two Component Epoxy System EP21AR

Two part, room temperature curable epoxy system with superior resistance to inorganic acids. Low viscosity. Used for bonding, sealing, coating, encapsulation. Serviceable from -60°F to +250°F. 100% reactive compound. Excellent dielectric strength. Especially noteworthy is its resistance to sulfuric and hydrochloric acids.

EP21ARHT Two Part Epoxy EP21ARHT

Serviceable from +400°F. Exceptional acid resistance. Cures at room temperature. Good flow properties. 100% reactive. Low shrinkage upon cure.
Withstands 1,000 hours 85°C/85% RH. Reliable electrical insulator. Adheres well to metals, glass, ceramics, rubbers and plastics. Shore D hardness 80-90.

EP21ARHTND Two Part Epoxy EP21ARHTND

Non-drip paste. Exceptional chemical resistance to acids. High bond strength. 100 to 50 mix ratio by weight. Formulated to cure at ambient temperatures. Used for coating pumps, storage vessels, tanks. Serviceable from -60°F to +400°F.

EP21ARLV

Two part, room temperature curable epoxy system with superior resistance to inorganic acids. Low viscosity. Used for bonding, sealing, coating, encapsulation. Serviceable from -60°F to +250°F. 100% reactive compound. Excellent dielectric strength. Especially noteworthy is its resistance to sulfuric and hydrochloric acids.

EP21BAS Two Part Radiopaque Epoxy EP21BAS

Two component, room temperature curing, radiopaque epoxy adhesive, sealant and coating. Employed for medical diagnostic and therapeutic devices. Effective for even 100 KV, px-ray (peak x-ray) machines and higher energy capacities. Convenient one to one mix ratio. High bond strength. Superior electrical insulation properties. Serviceable from -60°F to +250°F.

EP21CLV Two Part Adhesive EP21CLV

Two component epoxy adhesive, sealant, coating, potting, casting compound. Convenient one to one mix ratio. Cures at ambient temperatures. Good flow characteristics. Adjustable rigidity and flexibility by altering mix ratio. Durable bonds for similar and dissimilar substrates. Serviceable from -65°F to +250°F.

EP21D One Part Epoxy EP21D

General purpose epoxy adhesive/sealant. Gap filler. CUres at room temperature. Flexible and tough. Eletrical insulator. Serviceable from -60°F to +250°F. High peel strength.

EP21D3F2 Two Part Epoxy EP21D3F2

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